Glass Substrate Hybrid Panel With Reinforced Edge Frame
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Solution Overview
Problem
Glass substrates in electronics packaging are fragile and prone to damage during handling and processing, requiring specialized toolsets that are not widely available, making the transition to high-volume manufacturing costly and inefficient.
Innovation Solution
Implementing a metallic reinforcement ring over the frame and glass substrate, using resin coated copper layers to protect the edges, embedding glass substrates between RCC films, forming a plated metallic frame in-situ, and embedding glass substrates within dielectric layers to enhance mechanical strength and protect against delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If full-size glass panels are used as substrates, then mechanical strength and electrical performance are improved, but the edges become extremely vulnerable to damage during handling and processing
Solution Approach 1:
The patent segments the glass substrate into smaller unit substrates arranged in a grid pattern, separated by grooves. This segmentation reduces the overall size of individual glass pieces that need to be handled, thereby reducing edge damage vulnerability while maintaining the mechanical strength benefits of glass through the collective array structure.
Solution Approach 2:
The patent introduces an underfill material as an intermediary substance that fills the grooves between unit substrates and provides mechanical support to the edges of glass substrates. This underfill acts as a protective mediator that prevents edge damage during handling and processing while allowing the glass to maintain its inherent strength properties.
2Object-affected harmful factors
If specialized toolsets are designed for handling and processing glass panels, then edge damage is reduced, but technology improvement cost increases due to limited availability in high-volume manufacturing
Solution Approach 1:
By segmenting the glass into smaller unit substrates, the patent enables the use of existing standard manufacturing toolsets rather than requiring specialized equipment. The smaller size and grid arrangement of unit substrates allow them to be handled by conventional tools already available in high-volume manufacturing environments, thereby reducing technology improvement costs.
Solution Approach 2:
The patent applies underfill material in advance to fill the grooves between unit substrates before final assembly and processing. This preliminary action provides edge protection early in the manufacturing process, preventing damage during subsequent handling and eliminating the need for specialized protective toolsets later in the production line.
3Device complexity
If glass substrates are used without additional protective structures, then device complexity is reduced, but reliability during handling and processing deteriorates
Solution Approach 1:
The segmentation of glass into smaller unit substrates with grooves between them creates a modular structure that is inherently more reliable during handling. The grooves provide natural separation and support points, reducing the risk of catastrophic failure while adding minimal structural complexity compared to a monolithic glass design.
Solution Approach 2:
The underfill material serves as a simple intermediary that significantly improves handling reliability by providing edge support and preventing chipping. This relatively simple additive structure enhances reliability without substantially increasing device complexity, as the underfill integrates seamlessly into the existing substrate architecture.
Data Source
Figure 1~2B
Figure 2C~2E
Figure 2F~2H
AI summary
Embodiments disclosed herein include an apparatus that includes a substrate that comprises a glass layer. In an embodiment, a frame is provided around the substrate, and a gap is provided between an edge of the substrate and an interior edge of the frame. In an embodiment, a fill layer is provided in the gap, and the fill layer comprises a dielectric material. In an embodiment, a ring is provided over the fill layer around a perimeter of the substrate. In an embodiment, the ring comprises a metallic material.