Glass Core Package Panel Handling for Stress Fracture Prevention

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Solution Overview

Problem

Glass cores in IC packaging experience compressive stress-induced defects, such as seware stress fractures, during buildup processing, leading to catastrophic failures.

Innovation Solution

Incorporating a shock absorber material, such as polyurethane, between the panel frame and glass panel to mitigate stress, using glass handling structures with adjustable shapes like lip wedges, slanted wedges, or 'L' shapes to secure the glass panel during processing, and applying adhesive materials to prevent fractographical defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If glass core is used in IC packaging substrate, then high density vias and stiffness are provided, but compressive stress-induced defects occur during buildup processing

Engineering Contradiction:

ImprovestiffnessVSAvoidstress-induced defects

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

A stress mitigation glass panel handling structure is introduced as an intermediary component between the buildup layers and the glass core panel. This handling structure acts as a mediator that absorbs and distributes compressive stress, preventing direct transmission of stress to the glass core that would cause seware stress defects. The handling structure includes a frame with support elements positioned to bear the weight and stress of the buildup layers without concentrating force on the glass core.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The glass panel handling structure is designed with cushioning and stress-distributing features that are prepared in advance before buildup processing. The structure includes elements such as support bars, frames, and holding fixtures that are configured to absorb and distribute compressive forces before they can cause catastrophic failure of the glass core. This preemptive stress mitigation allows subsequent buildup layers to be applied without causing seware defects.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Productivity

If glass core is used in IC packaging substrate, then high density vias are provided, but catastrophic failures occur during panel-level processing

Engineering Contradiction:

Improvehigh density viasVSAvoidcatastrophic failures

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The glass panel handling structure serves as an intermediary support system that enables high-density via fabrication while preventing catastrophic failures. The handling structure provides a stable platform during panel-level processing operations, distributing mechanical stresses away from the glass core and preventing the conditions that lead to catastrophic failure during via formation and buildup processing.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If glass core is used in IC packaging substrate, then planarity issues are improved, but stress fractures occur during buildup processing

Engineering Contradiction:

ImproveplanarityVSAvoidstress fractures

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The glass panel handling structure acts as an intermediary that maintains planarity while preventing stress fracture. The structure includes flat support surfaces and distributed loading mechanisms that ensure the glass core remains planar during buildup processing without concentrating stress that would cause fractures. The handling structure's design allows uniform stress distribution across the panel surface.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents stress-related fractures, enhancing the yield and reliability of glass core package structures, enabling improved device performance in advanced 2.5D and 3D packaging.

Implementation Method 1

Incorporating a shock absorber material, such as polyurethane, between the panel frame and glass panel to mitigate stress

Methodology Applied

Scientific EffectShock absorption: Damping

Implementation Method 2

applying adhesive materials to prevent fractographical defects

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20260005126A1Methods of fabricating glass panels to form glass core package structures

Publication Date: 2026.01.01 INTEL CORP

AI summary

Microelectronic integrated circuit package structures include a package substrate comprising a build-up layer on a glass core, the glass core comprising a first side and a second side opposite the first side. A conductor is within a through glass via (TGV) extending through the glass core. A coating is on a sidewall of at least a portion of the glass core, the coating comprising a polymer material.