Glass Panel Via-Hole and Cutting Sequence to Prevent Breakage
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Solution Overview
Problem
The existing methods for manufacturing glass panels for display devices are time-consuming and costly, with a high risk of glass breakage and complications in handling due to the sequential process of cutting and forming via-holes, which complicates the production process and affects the quality of the final product.
Innovation Solution
A method that simultaneously forms via-holes and cuts a mother glass panel into unit cells using laser-irradiated deformed portions, with a first deformed portion for via-hole formation and a second deformed portion for cutting, followed by an etching process that completes cutting before via-hole formation, reducing the need for separate processes and minimizing glass damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the cutting process and via-hole formation process are performed sequentially, then each process can be completed with dedicated equipment, but the production time increases and the risk of glass breakage increases due to repeated handling
Solution Approach 1:
The patent combines the cutting process and via-hole formation process into a single simultaneous operation using a laser beam. The laser beam performs both functions in one pass through the glass substrate, eliminating the need for sequential processing and reducing handling steps that cause breakage.
Solution Approach 2:
The laser beam is used as a universal tool that can perform multiple functions: it can cut the glass substrate along cutting lines and form via-holes along via-hole lines simultaneously. This multi-functional approach eliminates the need for separate dedicated equipment for each process.
2Ease of manufacture
If the cutting process and via-hole formation process are performed sequentially, then each process can be optimized independently, but the number of handling steps increases causing glass breakage and process complexity
Solution Approach 1:
The patent merges multiple processing steps into a single simultaneous operation. The laser beam system integrates cutting and via-hole formation into one process step, reducing the total number of steps and simplifying the manufacturing flow.
3Reliability
If via-holes are formed after cutting, then the cutting process can be completed first, but subsequent via-hole formation requires additional handling increasing breakage risk
Solution Approach 1:
The patent performs via-hole formation simultaneously with cutting rather than as a subsequent step. By incorporating via-hole formation into the cutting process itself, the method eliminates post-cutting handling and reduces the risk of breakage during separate via-hole formation operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces production time and costs while preventing glass panel damage and improving display quality by allowing simultaneous cutting and via-hole formation, eliminating the need for separate processes and minimizing etchant-induced damage to the display layer.
Implementation Method 1
a first deformed portion is formed to a first depth from the upper surface of the glass substrate through irradiation with a laser beam
Implementation Method 2
a second deformed portion is formed to a second depth in the glass substrate through irradiation with a laser beam
Implementation Method 3
an etching step in which the glass panel with the first deformed portion and the second deformed portion formed therein is etched
Data Source
AI summary
A glass panel processing method includes a first deformed portion formation step in which, in order to form a via-hole in a glass substrate, a first deformed portion is formed to a first depth from the upper surface of the glass substrate through irradiation with a laser beam along a planned via-hole line, a second deformed portion formation step in which, in order to cut the glass substrate into unit cells, a second deformed portion is formed to a second depth in the glass substrate through irradiation with a laser beam along a planned cutting line, and an etching step in which, the glass substrate with the first deformed portion and the second deformed portion formed therein is etched such that etching of the glass substrate along the planned cutting line is completed before completion of etching of the glass substrate along the planned via-hole line.