Embedded Glass Patch Capacitor for Thick Package Substrate Alignment
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Solution Overview
Problem
Existing integrated circuit packaging technologies face challenges with deep trench capacitors (DTCs) shifting or rotating within the substrate core due to thickness mismatches, leading to yield, reliability, and manufacturability issues, particularly when the DTC thickness exceeds 600 microns.
Innovation Solution
Fabricating DTCs on glass panel substrates using wet etching processes to precisely control thickness and enable simultaneous formation on both sides, allowing for through-glass vias (TGVs) and reducing manufacturing costs, while ensuring the DTCs do not shift or rotate within the package substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If silicon-based DTCs are used with thickness limited to 600 microns, then manufacturing process compatibility is maintained, but thickness matching with thicker substrate cores (>600 microns) fails leading to shifting and rotation
Solution Approach 1:
The patent changes the material parameter from silicon to glass, which enables DTC thickness to be increased beyond 600 microns to match thicker substrate cores. This material substitution allows the DTC thickness parameter to be adjusted to match substrate thicknesses ranging from 600 microns to several millimeters, eliminating the thickness mismatch problem that causes shifting and rotation.
Solution Approach 2:
The patent employs glass as a composite material alternative to silicon for fabricating DTCs. Glass provides both the mechanical stability needed for thick substrate integration and the electrical properties required for capacitor functionality, creating a material that simultaneously satisfies thickness matching requirements and electrical performance specifications.
2Manufacturing precision
If DTC thickness is increased to match thick substrate cores, then thickness matching improves, but DTCs become prone to shifting or rotation within the cavity during encapsulation
Solution Approach 1:
The patent applies preliminary underfill material to the substrate core cavity before embedding the DTC. This underfill material is applied in advance to provide mechanical support and positioning features that prevent the DTC from shifting or rotating during the encapsulation process, ensuring position stability even for thick DTCs matching thick substrates.
Solution Approach 2:
The patent introduces underfill material as an intermediary substance between the DTC and the substrate core cavity. This intermediary material fills the gaps and provides mechanical interlocking features that prevent shifting and rotation, mediating the interface between the DTC and encapsulant while maintaining position stability during processing.
3Manufacturing precision
If thin DTCs are used to match 600 micron substrates, then thickness compatibility is achieved, but significant yield and reliability challenges occur due to voiding and misalignment
Solution Approach 1:
The patent changes the DTC thickness parameter from thin (600 microns) to thick (matching thick substrates), which eliminates the voiding and misalignment problems that cause yield losses. The thicker DTC structure provides better mechanical stability and ensures complete filling of encapsulant material, eliminating voids and improving alignment tolerance.
Solution Approach 2:
The patent applies underfill material preliminarily to provide mechanical support and improve alignment during DTC embedding. This preliminary action prevents misalignment and ensures proper positioning, thereby improving yield by reducing defects caused by placement errors.
4Ease of manufacture
If silicon processing limitations are followed, then process compatibility is maintained, but DTC thickness is constrained to 600 microns maximum
Solution Approach 1:
The patent changes the material parameter from silicon to glass, which removes the 600 micron thickness constraint imposed by silicon processing limitations. Glass can be fabricated with thicknesses ranging from 600 microns to several millimeters using standard glass processing techniques, enabling DTC thickness to be increased to match thick substrate cores without encountering silicon-specific processing barriers.
Solution Approach 2:
The patent substitutes glass for silicon as the DTC material, creating a composite material solution that maintains ease of manufacture through well-established glass processing techniques while eliminating the thickness constraints of silicon. This material substitution enables flexible thickness adjustment to match various substrate core thicknesses.
Data Source
AI summary
Microelectronic integrated circuit package structures include an apparatus having a a glass substrate embedded within a package substrate. The glass substrate comprises one or more trenches extending within a first portion, the one or more trenches comprising a first conductive layer on individual trench sidewalls, a dielectric layer on the first conductive layer and a second conductive layer on the dielectric layer. A second portion of the glass substrate is below the first portion.