Glass-Core PCB Capacitor Integration Without Cavity Embedding
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Solution Overview
Problem
Traditional substrate manufacturing methods for package substrates face design restrictions and increased process complexity due to the need for cavity formation and embedding of passive elements, especially when using organic materials, which becomes more challenging with thicker substrates and multiple passive elements.
Innovation Solution
A printed circuit board is designed with a glass core that integrates a wiring layer, through-via, and capacitor directly formed within the glass layer, eliminating the need for cavity processing and embedding, allowing for a desired capacitor size and capacitance without design restrictions and improving insulation thickness dispersion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive elements are mounted or embedded in traditional substrate manufacturing methods, then power characteristics are improved, but process complexity increases and design restrictions occur
Solution Approach 1:
The patent merges the capacitor structure with the substrate itself by forming capacitor electrodes and dielectric layers directly within the substrate layers. This integration eliminates the need for separate passive element mounting or embedding processes, thereby improving power characteristics while reducing process complexity and eliminating design restrictions associated with cavity formation.
2Reliability
If multiple passive elements are mounted, then power characteristics are improved, but manufacturing difficulty increases
Solution Approach 1:
The patent combines multiple capacitor structures into the substrate fabrication process itself, where capacitor electrodes and dielectric layers are formed simultaneously with the substrate layers. This approach allows multiple passive elements to be manufactured without increasing manufacturing difficulty, as the integration occurs during the standard substrate formation process rather than requiring separate mounting operations.
3Strength
If substrate thickness increases, then structural stability is improved, but cavity processing difficulty increases
Solution Approach 1:
The patent transitions from three-dimensional cavity formation and embedding to a two-dimensional layer integration approach. By forming capacitor electrodes and dielectric layers within the substrate planes during fabrication, the method eliminates the need for deep cavity processing in thick substrates, thereby maintaining structural stability while significantly reducing processing difficulty.
4Ease of manufacture
If organic materials are used in substrate manufacturing, then traditional manufacturing is simplified, but design restrictions and process complexity occur when mounting passive elements
Solution Approach 1:
The patent merges passive element formation with the organic substrate manufacturing process by integrating capacitor electrode and dielectric layer formation into the existing substrate fabrication steps. This approach maintains the simplicity of organic material manufacturing while eliminating the additional complexity of separate passive element mounting or embedding processes.
Data Source
AI summary
The present disclosure relates to a printed circuit board including: a glass layer; a first wiring layer disposed on an upper surface of the glass layer; and a capacitor including a plurality of blind holes penetrating through a portion of the glass layer from an upper surface to a lower surface of the glass layer, respectively, a first electrode layer disposed on the upper surface of the glass layer and extending into each of the plurality of blind holes, a second electrode layer disposed on the first electrode layer and disposed in each of the plurality of blind holes, and a first dielectric layer disposed between the first and second electrode layers.