Glass PCB Edge Insulation to Prevent Singulation Cracking
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Solution Overview
Problem
Printed circuit boards using glass materials are prone to defects such as cracking during singulation due to their vulnerability to impact, which compromises their reliability and integrity.
Innovation Solution
A printed circuit board design incorporating a glass layer with insulating layers covering the side surfaces and corner portions, and a structured manufacturing process that forms through-holes and vias to distribute stress, reducing exposure and risk of damage during singulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If glass materials are used in printed circuit boards, then design freedom and warpage control are improved, but the reliability deteriorates due to high vulnerability to impact and cracking during singulation
Solution Approach 1:
The patent applies beforehand cushioning by forming insulating layers that cover the side surfaces and corner portions of the glass layer before singulation occurs. These insulating layers act as a protective cushion that absorbs impact stress during the singulation process, preventing cracking while maintaining the design freedom benefits of using glass materials.
Solution Approach 2:
The patent employs composite materials by combining glass layer with insulating layers (such as resin or ceramic materials) to create a hybrid structure. This composite approach allows the glass to provide design freedom and warpage control while the insulating materials provide impact resistance and crack prevention, thereby improving overall reliability.
2Stability of the object's composition
If glass materials are used in printed circuit boards, then warpage control is improved, but the likelihood of cracking during singulation increases
Solution Approach 1:
The insulating layers are formed in advance on the glass layer's side surfaces and corner portions to provide cushioning protection before singulation occurs. This beforehand cushioning prevents impact-induced cracking while preserving the glass layer's excellent warpage control properties.
Solution Approach 2:
The patent applies local quality by selectively covering only the side surfaces and corner portions of the glass layer with insulating materials, rather than the entire surface. This localized approach provides crack protection at the most vulnerable areas (edges and corners) while maintaining the overall warpage control benefits of the glass layer.
3Reliability
If insulating layers cover the side surfaces and corner portions of the glass layer, then reliability is improved by reducing damage risk, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the insulating layer into multiple functional zones: a first insulating layer covering the side surfaces and a second insulating layer covering the corner portions. This segmented approach provides targeted protection where needed most while keeping the overall structure manageable and not excessively complex.
Solution Approach 2:
The insulating layers are applied locally only to the side surfaces and corner portions of the glass layer rather than uniformly across the entire board. This localized application reduces material usage and manufacturing complexity while providing reliability improvement at the specific locations most susceptible to damage during singulation.
Data Source
AI summary
A printed circuit board includes a glass layer having a first side surface and a second side surface, opposing each other in a first direction, a third side surface and a fourth side surface, opposing each other in a second direction, a first corner portion connecting the first side surface and the third side surface to each other, a second corner portion connecting the first side surface and the fourth side surface to each other, a third corner portion connecting the second side surface and the third side surface to each other, and a fourth corner portion connecting the second side surface and the fourth side surface to each other; a first insulating layer covering at least a portion of at least one side surface of the first to fourth side surfaces; and a second insulating layer covering at least one of the first to fourth corner portions.