Glass PCB Light Source Unit for LED Thermal Management
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Solution Overview
Problem
The existing display devices with light emitting diode (LED) backlight units face issues due to low thermal conductivity and poor flatness of circuit boards, leading to LED malfunctions, reduced lifetime, increased production costs, and reduced manufacturing efficiency.
Innovation Solution
A display device with a glass printed circuit board (PCB) that includes a copper layer and a molybdenum alloy diffusing barrier pattern, enhancing thermal conductivity and flatness, and using a solder resist to mount LEDs, which prevents detachment and improves bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a circuit board made of synthetic resin or insulating material is used, then the circuit board can be manufactured with standard processes, but the thermal conductivity is low causing LED malfunction and reduced lifetime
Solution Approach 1:
The patent applies composite materials by combining copper layers with glass substrate to create a glass PCB with enhanced thermal conductivity. The copper layers are embedded within the glass matrix, forming a composite structure that leverages the high thermal conductivity of copper while maintaining the mechanical properties of glass, thereby solving the thermal management issue for LED reliability
Solution Approach 2:
The patent changes the material parameter of the circuit board from conventional synthetic resin to glass-based composite material. This parameter change fundamentally improves thermal conductivity from typical resin values (0.2-0.5 W/mK) to the glass-copper composite values (1-5 W/mK), directly addressing the thermal management requirement for LED operation
2Manufacturing precision
If a circuit board with poor flatness is used, then manufacturing is simpler, but bonding of fine patterns is poor affecting productivity and yield
Solution Approach 1:
The patent changes the flatness parameter of the circuit board by using glass as the substrate material. Glass inherently provides superior flatness compared to conventional PCB materials, ensuring uniform bonding surfaces for fine patterns and connectors, which directly improves bonding quality and manufacturing yield
3Reliability
If conventional circuit board materials are used, then production costs are lower, but LED detachment and malfunction occur increasing rework and waste
Solution Approach 1:
The patent uses composite materials (glass-copper system) to achieve superior LED mounting stability. The glass substrate provides mechanical strength and thermal stability, while copper layers provide thermal conduction and electrical connectivity, creating a robust mounting environment that prevents LED detachment and malfunction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves thermal conductivity, prevents LED malfunctions, reduces production costs, and enhances manufacturing efficiency by stabilizing the LED mounting process and preventing detachment.
Implementation Method 1
a soldering pad located on a substrate of and including a copper (Cu) layer
Implementation Method 2
a first diffusing barrier pattern located on the soldering pad and including a molybdenum (Mo) alloy
Data Source
AI summary
A light source unit for a display device includes: a printed circuit board including a soldering pad located on a substrate of glass and including a copper layer, and a first diffusing barrier pattern located on the soldering pad and including a molybdenum alloy; and a light emitting diode mounted on the soldering pad through a solder resist. In one embodiment, the printed circuit board is a glass printed circuit board.