Glass PCB Via Structure for Integrated Optical and Electrical Links
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Solution Overview
Problem
Traditional organic packages face challenges in achieving high transmission speeds and securing transparency, with limitations in forming optical waveguides.
Innovation Solution
A printed circuit board design incorporating a glass substrate with through-portions, metal patterns, optical members, and dielectric layers to enable both electrical and optical signal connections, utilizing transparent dielectrics and mirrors for interlayer signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional organic packages are used, then cost is reduced and manufacturing maturity is improved, but transmission speed and transparency are insufficient
Solution Approach 1:
The patent changes the substrate material from traditional organic materials to glass substrate, fundamentally altering the material parameter to achieve high transmission speed and transparency while maintaining manufacturing feasibility through established glass processing techniques
Solution Approach 2:
The patent employs composite material structures including glass substrate combined with transparent dielectric layers, metal patterns, and optical waveguides to achieve both high-speed transmission and manufacturability
2Illumination intensity
If traditional organic packages are used, then manufacturing cost is reduced, but transparency and optical waveguide formation are limited
Solution Approach 1:
The patent changes the substrate material from traditional organic materials to glass substrate, fundamentally altering the material parameter to achieve high transmission speed and transparency while maintaining manufacturing feasibility through established glass processing techniques
Solution Approach 2:
The patent segments the via structure into distinct functional components: metal patterns for electrical connection, optical members for optical connection, and transparent dielectric layers for both, allowing each segment to be optimized for its specific function while maintaining overall manufacturability
3Reliability
If separate structures are used for electrical and optical connections, then connection reliability is improved, but device complexity and size increase
Solution Approach 1:
The patent merges electrical and optical connection functions into a single integrated via structure, where metal patterns provide electrical connection, optical members provide optical connection, and transparent dielectric layers provide both electrical insulation and optical transmission, thereby reducing device complexity while maintaining connection reliability
Solution Approach 2:
The transparent dielectric layer serves multiple functions simultaneously: electrical insulation for the metal patterns, optical transmission medium for the optical members, and structural support for the overall via structure, demonstrating multi-functionality that reduces overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design secures transparency and facilitates easy formation of optical waveguides, enhancing signal transmission capabilities and reducing product size by allowing both electrical and optical signals to be transmitted through a single via structure.
Implementation Method 1
a dielectric layer disposed on the substrate, filling the first through-portion and covering each of the metal pattern and the first optical member
Implementation Method 2
an optical waveguide pattern embedded in the dielectric layer and disposed on the substrate; and a mirror embedded in the dielectric layer and disposed on the first through-portion
Data Source
AI summary
The present disclosure relates to a printed circuit board including: a substrate having a first through-portion; a metal pattern disposed on at least one surface of the substrate and extending onto a wall surface of the first through-portion; a first optical member disposed in the first through-portion; a dielectric layer disposed on the substrate, filling the first through-portion and covering each of the metal pattern and the first optical member, an optical waveguide pattern embedded in the dielectric layer and disposed on the substrate; and a mirror embedded in the dielectric layer and disposed on the first through-portion.