Glass-Substrate PCB Layout for Vertical Passive Component Integration
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Solution Overview
Problem
The use of glass fiber and resin materials in printed circuit boards (PCBs) leads to increased horizontal area occupation due to the placement of electronic components, hindering the miniaturization of electronic devices.
Innovation Solution
A circuit board structure utilizing a glass substrate with conductive penetration structures, conductive and insulating layers, and passive components, allowing for vertical integration of components and flexibility through a rigid-flex composite design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are placed on the PCB, then the functional capability is improved, but the horizontal area occupation is increased
Solution Approach 1:
The patent transitions from two-dimensional planar placement of electronic components on the PCB surface to three-dimensional vertical integration by embedding passive components within the PCB structure itself. This dimensional change allows components to be stacked and integrated in the vertical direction, significantly reducing the horizontal footprint while maintaining or enhancing functional capability.
Solution Approach 2:
The patent implements nesting by placing passive components (such as resistors, capacitors, and inductors) inside the PCB structure, effectively nesting components within the substrate. This nested arrangement allows multiple components to occupy the same horizontal space by utilizing the vertical dimension, thereby reducing overall area occupation while preserving functional versatility.
2Stability of the object's composition
If glass fiber and resin materials are used for PCB, then the structural stability is improved, but the horizontal area occupation is increased
Solution Approach 1:
The patent maintains the structural stability provided by glass fiber and resin materials while utilizing the vertical dimension for component integration. By embedding passive components within the multi-layer PCB structure, the design achieves both structural integrity and area reduction, as the stable substrate provides a rigid framework for three-dimensional component arrangement.
Solution Approach 2:
The patent employs composite materials consisting of glass fiber reinforced resin in the PCB substrate, combining the mechanical strength and stability of glass fiber with the bonding and insulating properties of resin. This composite structure provides a stable foundation that supports the vertical integration of passive components, achieving both structural stability and reduced horizontal footprint.
3Area of stationary object
If passive components are integrated vertically in the glass substrate, then the horizontal footprint is reduced, but the manufacturing complexity is increased
Solution Approach 1:
The patent divides the PCB into multiple functional layers and segments, with passive components embedded in specific layers and conductive traces routed through dedicated pathways. This segmentation allows for modular manufacturing processes, where each layer can be prepared and assembled separately before final integration, thereby managing manufacturing complexity while achieving vertical component integration and footprint reduction.
Solution Approach 2:
The patent employs preliminary actions in the manufacturing process by pre-forming conductive traces, insulating layers, and component mounting structures within the glass substrate before final component assembly. This preliminary preparation of the substrate structure simplifies the overall manufacturing process by establishing a ready-made framework that guides subsequent assembly steps, reducing the complexity associated with vertical integration.
Data Source
AI summary
A circuit board structure includes a glass substrate, a plurality of conductive penetration structures, a first conductive layer, a first insulating layer, a second conductive layer and a plurality of passive components. The conductive penetration structures are disposed on the rigid substrate of the glass substrate. The first conductive layer is disposed on the glass substrate. The first conductive layer includes a plurality of first conductive traces and a plurality of first conductive patterns. One of the first conductive traces is electrically connected to one of the conductive penetration structures, and one of the first conductive patterns is electrically connected to one of the first conductive traces. The first insulating layer is disposed on the glass substrate to cover the first conductive layer. The second conductive layer is disposed on the first insulating layer, and the second conductive layer includes a plurality of second conductive patterns.