Glass Co-Packaged PIC-EIC Assembly for Passive Optical Alignment

The patent implements preliminary action by pre-defining alignment features directly on the PIC die during fabrication, and pre-forming corresponding alignment structures on the substrate before EIC die attachment. This preliminary preparation eliminates the need for complex active alignment during final assembly, as components are pre-positioned with precise geometric references that guide automatic alignment.

The patent introduces an intermediary alignment structure that mediates between the PIC die and EIC die. This intermediate layer includes alignment features such as through-holes, recesses, or protrusions that serve as geometric references, enabling passive alignment without requiring complex active alignment systems. The intermediary structure transfers positional information from the substrate to the PIC die, simplifying the overall alignment process.

The patent transitions from planar two-dimensional packaging to three-dimensional stacked packaging. Multiple EIC dies and PIC dies are vertically stacked on the substrate, utilizing the vertical dimension to increase compute density. This 3D architecture reduces the optical path length between components while maintaining high integration density, thereby reducing optical signal loss and meeting future compute density requirements.

The patent segments the photonic and electronic functions into separate PIC and EIC dies that are co-packaged on the same substrate. This segmentation allows each die to be optimized for its specific function while being positioned in optimal locations to minimize optical signal loss. The modular segmented architecture enables flexible arrangement of components to achieve both high compute density and low optical loss.

The patent implements self-service alignment where the alignment features are self-aligning through geometric constraints. The through-holes, recesses, or protrusions on the substrate and PIC die automatically guide positioning during attachment, eliminating the need for external active alignment systems. This self-aligning mechanism maintains high precision even in high-volume manufacturing where manual adjustment is not feasible.

The patent replaces complex mechanical active alignment systems with simple geometric alignment features. Instead of using mechanical adjustment mechanisms, motors, or sensors for alignment, the design uses predetermined geometric references such as aligned holes or protrusions that provide passive mechanical guidance during attachment, enabling high-volume manufacturing with maintained precision.