Glass Plate Module Connection Terminal Segmentation

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Solution Overview

Problem

The existing connection terminals for glass plates, fixed with lead-free solder, are prone to cracking when external forces are applied due to the hardness of lead-free solder, which can lead to detachment or damage of the electrically conductive layer and glass plate.

Innovation Solution

A glass plate module design featuring a connection terminal with a standing portion between the installation and connection portions, where the lead-free solder extends further towards the power supply portion, reducing stress concentration and preventing direct connection between the solder and the electrically conductive layer, thus preventing cracking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If lead-free solder is used to fix the connection terminal to the electrically conductive layer, then the connection terminal can be securely fixed, but the solder is hard and may cause cracking when external force is applied

Engineering Contradiction:
Improvefixing strengthVSAvoidcracking risk
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The connection terminal is divided into three distinct portions: installation portion, standing portion, and connection portion. This segmentation isolates the stress application point from the solder joint, preventing force transmission to the brittle lead-free solder and eliminating cracking risk while maintaining secure fixation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The standing portion acts as an intermediary element between the installation portion (soldered to glass) and the connection portion (cable attachment). This intermediate structure absorbs and redirects external forces, preventing them from reaching the solder joint and causing cracks.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the connection terminal is directly connected to the electrically conductive layer via lead-free solder, then electrical connection is established, but stress concentration occurs at the solder end portion when force is applied

Engineering Contradiction:
Improveelectrical connectionVSAvoidstress concentration
Core Design Contradiction:
ReliabilityVSStress or pressure

Solution Approach 1:

The terminal structure segments the electrical connection path from the mechanical force path. The installation portion provides electrical connection through solder, while the standing and connection portions form a separate mechanical pathway that directs forces away from the solder joint, eliminating stress concentration.

Inventive Principle:
Principle #1Segmentation

3Device complexity

If the connection portion is positioned close to the installation portion, then the device structure is compact, but stress from cable pulling directly affects the solder joint

Engineering Contradiction:
Improvestructure compactnessVSAvoidsolder joint damage
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The connection terminal utilizes vertical space by extending the standing portion upward from the glass surface, rather than only horizontal expansion. This three-dimensional arrangement maintains electrical compactness while providing mechanical separation, allowing the connection portion to be positioned away from the solder joint in the vertical dimension.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively prevents cracking of the electrically conductive layer and glass plate even under external forces, ensuring the connection terminal remains attached and reducing the risk of damage.

Implementation Method 1

when the lead-free solder is melted by heating the connection terminal

Methodology Applied
Scientific EffectMelting: Melting

Data Source

PatentUS11225059B2Glass plate module
Publication Date: 2022.01.18 NIPPON SHEET GLASS CO LTD
  • US11225059B2 patent drawing
  • US11225059B2 patent drawing
  • US11225059B2 patent drawing

AI summary

A glass plate module according to the present invention includes a glass plate, an electrically conductive layer laminated on the glass plate, at least one connection terminal fixed to the electrically conductive layer and made of an electrically conductive material, and lead-free solder for fixing the connection terminal to the electrically conductive layer. The connection terminal includes an installation portion that is fixed to the electrically conductive layer via the lead-free solder, a standing portion that extends from an end portion of the installation portion in a direction away from the glass plate, and a connection portion that is coupled to an end portion of the standing portion on the opposite side to the installation portion and extends in a direction away from the installation portion along a surface direction of the glass plate.