Thin Glass Substrate Pre-Separation With Localized Flattening
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Thin glass substrates with intrinsic stresses and large surface areas pose challenges during processing, as they tend to fracture uncontrollably along separation lines due to uneven cooling and flattening stresses, making it difficult to achieve sufficient flatness for methods like laser filamentation or scribing.
Innovation Solution
A method involving a substrate carrier that applies a force only in specific action zones, allowing the substrate to form temporary deformations locally, thereby increasing flatness without applying stress across the entire surface, enabling controlled pre-separation and processing while minimizing overall stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the glass substrate is tensioned and flattened on the supporting surface to achieve sufficient flatness for processing, then the flatness is improved, but additional stresses are introduced that can cause uncontrolled fractures along the processed separation lines
Solution Approach 1:
The patent applies local quality by tensioning and flattening the glass substrate only in a specific action zone rather than across the entire substrate surface. This localized approach provides sufficient flatness for processing in the required area while avoiding the introduction of additional stresses across the whole substrate that would cause uncontrolled fractures. The selective application of mechanical action to specific regions resolves the contradiction between achieving local flatness and maintaining overall structural integrity.
2Shape
If the glass substrate is tensioned across the entire surface to achieve flatness, then the flatness is improved, but the additional stresses exceed the strength of the processed separation lines causing uncontrolled fractures
Solution Approach 1:
The patent implements local quality by restricting the tensioning and flattening action to a defined action zone rather than applying it across the entire substrate. This ensures that the separation lines, particularly those processed by laser filamentation or scribing, are not subjected to additional stresses that would compromise their integrity. The localized mechanical action maintains separation line strength while providing adequate flatness for processing in the action zone.
3Productivity
If the size of the glass substrates is increased, then the productivity is improved, but the stresses that occur on flattening of the deformations become greater leading to more critical fracture risks
Solution Approach 1:
The patent resolves the contradiction between increased substrate size and fracture resistance by applying local quality principles. Instead of attempting to flatten and tension large substrates across their entire surface—which generates excessive stresses and fracture risks—the method applies mechanical action only to a localized action zone. This enables processing of large substrates while maintaining their structural integrity, as the majority of the substrate remains unstressed and free from deformation-induced stresses.
4Strength
If the glass substrate is not tensioned sufficiently, then the stress introduction is minimized, but the flatness is insufficient for processing methods like laser filamentation or scribing
Solution Approach 1:
The patent applies local quality by creating a localized action zone where the glass substrate is selectively tensioned and flattened. This provides sufficient flatness for processing methods such as laser filamentation or scribing within the action zone while minimizing the introduction of stresses to the rest of the substrate. The differentiated treatment of different substrate regions resolves the contradiction between achieving necessary flatness and maintaining fracture resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for controlled pre-separation and processing of thin glass substrates with reduced stress, preventing uncontrolled fractures and enabling the production of high-quality glass products even with large surface areas and intrinsic material stresses.
Implementation Method 1
the substrate is subjected in the region of an action zone to a force acting in the direction of the substrate carrier, especially such that the substrate is brought closer to the substrate carrier in the region of the action zone
Implementation Method 2
is not subjected to the force acting in the direction of the substrate carrier in the region of an equalizing zone, especially such that the substrate is able to form temporary deformations in the region of the equalizing zone
Data Source
AI summary
A method of processing two-dimensional substrates is provided. The method includes placing the substrate onto a substrate carrier and subjecting the substrate to a force acting towards the substrate carrier in an action zone of the substrate, but not in a compensation zone of the substrate. The substrate is predivided while being subjected to the force.