Glass Substrate With Resin Penetrating Through Holes
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Solution Overview
Problem
Forming miniaturized through holes in a glass plate substrate for semiconductor devices is challenging due to difficulties in precision and efficiency with existing methods like laser trimming or plasma etching, which hinder the establishment of effective through hole formation techniques.
Innovation Solution
A semiconductor device design featuring a glass plate substrate with resin portions and through wiring that penetrates through the resin, allowing for easier formation of minute through holes and improved electrical connectivity between wiring layers, using methods like laser processing and electroless plating, without directly forming holes in the glass plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser trimming or plasma etching is used to form through holes in glass plate substrate, then through holes can be formed, but the miniaturization precision and manufacturing efficiency are insufficient
Solution Approach 1:
The through hole formation process is segmented into two stages: first forming a through hole in the resin layer, then using this resin through hole as a template to form the final through hole in the glass plate. This segmentation allows the difficult glass etching to be replaced by easier resin processing followed by precise glass hole formation using the resin hole as a guide.
Solution Approach 2:
The resin layer acts as an intermediary medium between the wiring layers and the glass plate. By forming through holes in the resin layer first, the resin serves as a template and mediator that enables precise through hole formation in the glass plate without requiring direct high-precision glass etching.
2Reliability
If through holes are formed directly in glass plate, then electrical connectivity can be achieved, but the manufacturing process becomes complex and inefficient
Solution Approach 1:
The resin layer is prepared in advance with through holes formed before the glass plate etching process. This preliminary action of creating through holes in the resin layer serves as a template that guides the subsequent glass plate processing, enabling more efficient manufacturing by avoiding direct high-precision glass hole formation.
Solution Approach 2:
The manufacturing process is divided into distinct stages: resin layer processing to form through holes, followed by glass plate processing using the resin holes as templates. This segmentation improves productivity by separating the difficult glass etching step from the easier resin processing step.
3Reliability
If conventional through hole methods are used, then wiring layers can be connected, but thermal expansion issues and substrate shape flexibility are limited
Solution Approach 1:
The substrate structure uses a composite of resin layer and glass plate, where the resin layer provides flexibility in shape and thermal expansion characteristics, while the glass plate provides structural support. This composite structure enables both reliable wiring connectivity and greater substrate shape flexibility.
Solution Approach 2:
The resin layer's thermal expansion properties differ from conventional substrates, allowing for adjusted thermal expansion parameters that reduce thermal stress. The resin material parameters can be selected to match the semiconductor chip, improving reliability while enabling shape flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates the manufacturing of semiconductor devices with precise and efficient through hole formation, simplifying the process and enhancing electrical connectivity between layers, while allowing for flexible substrate shapes and reduced thermal expansion issues.
Implementation Method 1
a resin portion penetrating through the first surface to the second surface
Implementation Method 2
a through wiring penetrating through the resin portion from the first surface to the second surface to electrically connect a first wiring layer formed on a side of the first surface with a third wiring layer formed on a side of the second surface
Implementation Method 3
using methods like laser processing
Implementation Method 4
using methods like laser processing and electroless plating
Data Source
AI summary
A semiconductor device includes a wiring substrate, and a semiconductor chip, wherein the wiring substrate includes a glass plate having an opening portion penetrating through a first surface of the glass plate to a second surface of the glass plate, a resin portion penetrating through the first surface to the second surface, and a through wiring penetrating through the resin portion from the first surface to the second surface to electrically connect a first wiring layer formed on a side of the first surface with a third wiring layer formed on a side of the second surface, wherein the semiconductor chip is accommodated inside the opening portion.