Strengthened Glass Scratch Repair Without Disassembly or Polishing Liquid
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for polishing reinforced glass on electronic devices, such as mobile phones and tablets, require disassembly, use harmful liquids, generate dust, and can damage internal circuits, making them unsuitable for scratch repair without risking data loss or circuit damage.
Innovation Solution
A digital polishing method using an abrasive, such as diamond or silicon carbide, with controlled contact pressure and temperature, applied without polishing liquids, utilizing a water mist to maintain low temperatures and prevent dust generation, ensuring the glass surface is polished without disassembly and internal damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional mechanical polishing with polishing fluid is used, then polishing effectiveness is improved, but harmful liquids and dust are generated that can damage internal circuits
Solution Approach 1:
The patent extracts and removes the polishing fluid from the traditional polishing process, using only dry abrasive particles. This eliminates the harmful liquid that could damage internal circuits while maintaining polishing effectiveness through controlled mechanical action of the abrasive on the glass surface.
Solution Approach 2:
The patent creates a controlled environment by using a polishing cover that contains the polishing area, effectively creating an isolated space where polishing occurs without releasing dust and debris into the surrounding area, protecting internal circuits from contamination.
2Ease of operation
If the glass is disassembled for polishing, then access to the glass surface is improved, but data loss and circuit damage risks increase
Solution Approach 1:
The patent develops a universal polishing apparatus that can polish the glass surface of electronic devices while they remain assembled. The device is designed to work on the external glass surface without requiring disassembly, making it applicable to various device types while eliminating the risks associated with opening devices.
3Productivity
If high contact pressure is applied during polishing, then scratch removal efficiency is improved, but temperature increase can cause glass cracking or circuit damage
Solution Approach 1:
The patent employs periodic or intermittent polishing action with controlled pressure application. The polishing head moves in specific patterns with varying pressure, allowing heat dissipation between polishing cycles and preventing excessive temperature buildup that could crack the glass or damage circuits.
Solution Approach 2:
The patent uses dynamic pressure control where the contact pressure between the abrasive and glass surface is continuously adjusted during the polishing process. The pressure varies based on the polishing stage, scratch depth, and real-time temperature monitoring, optimizing scratch removal while preventing overheating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes scratches from electronic device glass surfaces without disassembly, maintaining the glass's smoothness and brightness while preventing damage to internal circuits, as the method operates within safe temperature limits and avoids liquid exposure.
Implementation Method 1
an abrasive is used to polish a substrate surface without the presence of a polishing liquid
Implementation Method 2
utilizing a water mist to maintain low temperatures
Data Source
Figure 1~2
Figure 3
AI summary
The invention relates to a method and a device for repairing scratches on strengthened glass surface. The method comprises the following steps: (1) polishing the substrate surface with abrasive without the presence of polishing liquid, wherein the polishing treatment is carried out under the condition that the contact pressure between the abrasive and the substrate surface is 0.8-4N and the substrate surface temperature is less than 40°C; (2) The substrate surface after step (1) is processed with mirror treatment with abrasive without the presence of polishing liquid, wherein the polishing is carried out under a pressure of 0.4-2N contact pressure between the abrasive and the substrate, and a temperature of the substrate surface less than 25°C. The method and equipment can effectively remove or reduce the scratch on the strengthened glass surface of electronic products without dismantling the machine, restore the smoothness of the glass, and achieve the mirror effect.