Glass-Sealed LED Lamp with Clearance for Light Extraction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional glass-sealed LED lamps face issues with light absorption by the mounting substrate, leading to reduced light extraction efficiency due to direct bonding of the glass sealing body to the substrate without clearance, and potential cloudiness of the glass sealing body made from powdered glass.
Innovation Solution
Incorporating a clearance between the glass sealing body and the mounting substrate, which causes total reflection, and using a glass bonding portion with a lower yielding point than the glass sealing body to facilitate bonding without heating the LED chip excessively, thereby reducing light absorption and improving extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the glass sealing body is made of powdered glass, then it can be formed by heating, but it becomes cloudy and scatters light
Solution Approach 1:
The patent changes the physical state parameter of glass from powdered form to plate form. Plate glass maintains transparency while still being formable through heating processes, thereby resolving the contradiction between ease of manufacture and light transparency.
2Strength
If the glass sealing body is bonded directly to the mounting substrate without clearance, then bonding strength is improved, but light absorption by the substrate increases
Solution Approach 1:
The patent segments the bonding interface by introducing a clearance (gap) between the glass sealing body and the mounting substrate. This segmentation prevents direct contact, thereby reducing light absorption by the substrate while maintaining bonding strength through alternative bonding mechanisms at the edges or through adhesive materials.
3Illumination intensity
If heating temperature is increased to prevent cloudiness of powdered glass, then transparency is improved, but heat load on LED chip increases
Solution Approach 1:
The patent changes the material form parameter from powdered glass to plate glass, which allows forming at lower temperatures while maintaining transparency. This parameter change resolves the contradiction between achieving transparency and minimizing heat load on the LED chip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The clearance between the glass sealing body and the mounting substrate reduces light absorption and enhances light extraction efficiency by ensuring total reflection, while the lower yielding point glass bonding portion simplifies the bonding process and minimizes heat load on the LED chip.
Implementation Method 1
a clearance between a lower surface of the glass sealing body and an upper surface of the mounting substrate side, which causes total reflection at an interface between the glass sealing body and the clearance
Implementation Method 2
The whole lower surface of the glass sealing body is bonded to an upper surface of a mounting substrate by thermal fusion bonding
Data Source
AI summary
The present invention provides a glass-sealed LED lamp which includes a mounting substrate, an LED chip mounted on the mounting substrate, a glass sealing body, and a glass bonding portion bonding the LED chip to a portion of a lower surface side of the glass sealing body. A clearance between a lower surface of the glass sealing body and an upper surface of the mounting substrate side, which causes total reflection at an interface between the glass sealing body and the clearance, is formed outward of the portion of the lower surface side of the glass sealing body.