Multilayer Electronic Component Glass Sealing for Moisture Blocking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic capacitors face challenges with moisture permeation and plating solution ingress, leading to reliability issues due to insufficient sealing methods, particularly in miniaturized designs with increased capacitance.
Innovation Solution
Incorporating glass-based sealing portions and diffusion portions on the multilayer electronic component, where the sealing portions extend beyond the external electrodes to create a barrier against moisture and plating solutions, with specific thickness and length criteria to enhance moisture resistance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealing methods are applied to block moisture permeation, then moisture resistance reliability is improved, but device complexity increases due to additional sealing portions and diffusion portions
Solution Approach 1:
The patent merges the sealing portions and diffusion portions into a unified glass-based barrier system. The sealing portions extend from the external electrodes and merge with diffusion portions that penetrate into the body, creating an integrated moisture barrier structure rather than separate sealing and diffusion components
Solution Approach 2:
The patent employs composite material structure where glass is used in both the sealing portions and diffusion portions. The glass material forms a composite barrier system that combines sealing functionality at the surface with diffusion blocking functionality inside the body, achieving enhanced moisture resistance through material composition rather than complex mechanical structures
2Reliability
If glass-based sealing portions are extended beyond external electrodes, then moisture permeation is blocked effectively, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies parameter ranges for the sealing portions, including length of 20 μm or more extending from external electrodes, and thickness ratios between sealing portions and external electrodes. These parameter specifications provide clear manufacturing targets while allowing flexibility within defined ranges, balancing precision requirements with manufacturing feasibility
3Volume of moving object
If miniaturization is pursued for capacitor designs, then device size is reduced, but moisture resistance reliability deteriorates due to insufficient sealing
Solution Approach 1:
The patent implements a nested barrier structure where sealing portions are positioned on the outer surface extending from external electrodes, and diffusion portions are nested inside the body penetrating into the internal structure. This nested arrangement creates multiple layers of moisture protection within the miniaturized component, maintaining reliability while reducing overall size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The glass-based sealing and diffusion portions effectively block moisture and plating solution permeation, significantly improving the moisture resistance reliability of multilayer electronic components, even in miniaturized forms, by extending beyond the external electrodes and integrating with the internal structure.
Implementation Method 1
the sealing portions extend beyond the external electrodes to create a barrier against moisture and plating solutions
Data Source
AI summary
A multilayer electronic component includes a body including a dielectric layer and an internal electrode, an external electrode disposed outside the body, and sealing portions disposed on outer surfaces of the body, wherein the external electrodes and the sealing portions include glass, the sealing portions include first sealing portions that are disposed between the body and the external electrodes, and second sealing portions that extend from the first sealing portions in the second direction and are not in contact with the external electrodes, and an average length of the second sealing portion is 20 μm or more.