Laser-Formed Glass Separation Lines to Prevent Pre-Separation
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Solution Overview
Problem
Glass plates often undergo unintended pre-separation before the intended separation process, leading to complications in handling and degradation of glass articles due to scratches or cracks on end faces.
Innovation Solution
A glass plate design featuring separation lines formed by laser irradiation, with product lines and release lines, where the product lines have in-plane void arrays with a maximum distance between adjacent voids of 1-10 µm and release lines have a greater distance between voids, preventing unintentional separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separation lines are formed by laser irradiation to enable glass article separation, then the glass plate can be divided into desired shapes, but unintended pre-separation may occur before the predetermined separation step
Solution Approach 1:
The patent applies local quality by creating two distinct types of separation lines with different void structures: product lines with densely spaced voids (1-10 µm) that resist pre-separation, and release lines with sparsely spaced voids (>10 µm) that facilitate controlled separation. This local differentiation allows the glass plate to have both regions resistant to unintended separation and regions designed for easy separation.
Solution Approach 2:
The separation line system is segmented into two functional types: product lines and release lines. Product lines form the outline of glass articles and include internal void arrays that extend through the glass thickness, creating strong separation resistance. Release lines are positioned at predetermined separation locations with sparser void arrays, enabling controlled separation when needed.
2Productivity
If pre-separation occurs, then the glass plate is divided into pieces against intention, but handling becomes complicated and quality degrades due to scratches or cracks
Solution Approach 1:
The patent applies preliminary anti-action by pre-forming product lines with densely spaced internal void arrays (1-10 µm) that create resistance to pre-separation forces. These void structures are created during the laser irradiation process before any separation occurs, providing preemptive protection against unintended division and the associated harmful effects like scratches and cracks.
3Reliability
If product lines have densely spaced voids (1-10 µm) to prevent pre-separation, then separation resistance increases, but manufacturing complexity increases
Solution Approach 1:
The patent applies parameter changes by varying the spacing parameter of voids between product lines and release lines. Product lines use a spacing parameter of 1-10 µm to create high separation resistance, while release lines use a spacing parameter of >10 µm to enable easy separation. This systematic parameter variation allows control over separation behavior without requiring fundamentally different structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces the likelihood of pre-separation, ensuring glass articles are separated as intended and maintaining the quality by preventing scratches and cracks during handling and chemical tempering processes.
Implementation Method 1
separation lines being formed in the glass plate and on the first main surface by irradiating the glass plate with laser light
Data Source
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AI summary
Separation lines are formed in a glass plate having first and second main surfaces by irradiating with laser light. The separation lines are configured of a product line corresponding to an outline of a glass article to be separated from the glass plate; and a release line. The product line includes a first in-plane void array configured of in-plane voids arranged on the first main surface. A maximum distance between centers of the adjacent in-plane voids arranged on the first main surface falls within a range of 1 µm to 10 µm. The release line includes internal void arrays for release line, which are arranged along lines connecting the first and second main surfaces, respectively. A maximum distance between centers of the adjacent points, at which extension lines extended from the internal void arrays for release line cross the first main surface, is greater than 10 µm.