Glass Sheet Carrier Bonding via Surface Modification Layers
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Solution Overview
Problem
Current methods for processing flexible glass sheets on carriers face challenges in maintaining a strong bond during high-temperature FPD processes without causing contamination or permanent bonding, which limits the reuse of carriers and the ability to remove thin glass sheets without damage.
Innovation Solution
The use of surface modification layers on the thin sheet and carrier, combined with controlled bonding surface preparations, to achieve a balance between room-temperature van der Waals and high-temperature covalent bonding, allowing for a strong bond during processing while enabling easy debonding after high-temperature processing without damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If commercial adhesives are used to bond thin glass to carrier, then bonding strength is improved, but contamination of FPD processes occurs due to outgassing of volatiles and solvents
Solution Approach 1:
The patent employs a disposable thin glass sheet that is bonded to the carrier for the duration of FPD processing, then removed and discarded. This eliminates the need for reusable adhesives that would outgas during processing, as the bonding interface is created fresh for each device fabrication cycle. The thin glass sheet serves as a temporary bonding medium that fulfills its purpose and is then discarded, preventing contamination issues.
Solution Approach 2:
The patent extracts the adhesive layer from the bonding system entirely, replacing it with direct van der Waals bonding between the thin glass sheet and carrier. By removing the adhesive intermediary that would outgas and contaminate the FPD process, the system achieves clean bonding without the harmful effects of polymer adhesive decomposition during high-temperature processing.
2Strength
If strong covalent bonding is formed between thin glass and carrier during high-temperature processing, then bonding strength is improved, but carrier reuse becomes impossible
Solution Approach 1:
The patent creates a dynamic bonding system where the bond strength evolves during processing. Initially, van der Waals forces provide sufficient bonding at room temperature. During high-temperature FPD processing, the bond strengthens through increased van der Waals interactions and possible covalent bonding. After processing, the bond can be reversed through controlled heating or chemical treatment, allowing carrier reuse. This dynamic behavior allows the system to adapt to different process stages.
Solution Approach 2:
The patent utilizes parameter changes in temperature and surface chemistry to control bonding strength. By heating the assembly during processing, van der Waals bonds are strengthened. For carrier reuse, subsequent heating to higher temperatures or exposure to specific chemicals can reverse the bonding, allowing the thin glass sheet to be removed from the carrier while maintaining carrier integrity for future use.
3Reliability
If thin glass sheet is bonded to carrier for FPD processing, then device quality is improved, but removal of thin glass sheet without damage becomes difficult
Solution Approach 1:
The patent segments the bonding interface into distinct regions with different bonding characteristics. The central region maintains strong bonding during processing to ensure device quality, while peripheral regions are designed with weaker bonding that allows for controlled release. This segmentation enables the thin glass sheet to be removed from the carrier after processing without damage, as the release can occur at predetermined locations.
Solution Approach 2:
The patent applies preliminary surface treatments to the thin glass sheet and carrier that create controlled bonding characteristics. Surface coatings or treatments are applied beforehand that provide sufficient bonding strength during FPD processing but can be easily reversed or deactivated after processing. This preliminary preparation ensures both device quality during processing and ease of removal afterward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the thin glass sheet to withstand harsh FPD processing conditions, including high temperatures, while allowing for the reuse of the carrier and the removal of the thin glass sheet without damage, maintaining hermeticity and preventing outgassing.
Implementation Method 1
bonding a first bonding surface of a carrier to a second bonding surface of a thin sheet, wherein the bonding surfaces are bonded together by van der Waals bonding
Implementation Method 2
forming a controlled bond between the carrier and the thin sheet wherein a separation force can separate the thin sheet portion from the carrier without damage to either the thin sheet or the carrier caused by the bond
Data Source
Figure 1~6
Figure 2
Figure 3~5
AI summary
Surface modification layers (30) and associated heat treatments, that may be provided on a sheet (20), a carrier (10), or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.