Glass Sheet Melt-Solidified End Surface for Semiconductor Substrate Support
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Solution Overview
Problem
The manufacturing method of fan-out type Wafer Level Packages (WLPs) faces challenges in maintaining substrate dimension stability during high-temperature processing, leading to deformation and reduced accuracy in high-density wiring and solder bump formation, while glass sheets used for support are prone to breaking due to microcracks and chipping.
Innovation Solution
A glass sheet with a total thickness variation of less than 2.0 μm and a melt-solidified surface on the end surface, formed through laser irradiation and polishing, enhances processing accuracy, mechanical strength, and reduces the likelihood of breakage during handling and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a glass sheet is used as a supporting plate, then the substrate to be processed can be supported strongly and accurately, but the glass sheet is liable to be broken during loading/unloading, conveyance, or processing
Solution Approach 1:
The glass sheet undergoes preliminary surface treatment (chemical strengthening or ion exchange) before use to enhance its mechanical strength and breakage resistance, allowing it to maintain support accuracy while resisting breakage during handling and processing
Solution Approach 2:
The physical and chemical parameters of the glass sheet are modified through heat treatment or chemical processing to alter its mechanical properties, increasing its strength-to-weight ratio and improving breakage resistance while maintaining its dimensional stability for accurate support
2Productivity
If the substrate to be processed is subjected to high-temperature processing, then the semiconductor chips can be sealed and wired, but the sealing material may be deformed and the substrate to be processed may change in dimension
Solution Approach 1:
The glass sheet is selected or engineered to have a thermal expansion coefficient that matches or compensates for the substrate and sealing material, minimizing dimensional changes during high-temperature processing and maintaining manufacturing precision throughout the sealing and wiring operations
3Object-affected harmful factors
If the end surface of the glass sheet is chamfered by polishing, then chipping can be reduced, but microcracks cannot be completely removed and end surface strength cannot be increased sufficiently
Solution Approach 1:
The mechanical polishing process is replaced or supplemented with chemical strengthening methods (ion exchange or chemical vapor deposition) that can penetrate and strengthen the glass structure at the molecular level, completely eliminating microcracks and significantly increasing end surface strength beyond what mechanical means alone can achieve
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-density wiring and increased mechanical strength, allowing for more reliable and accurate semiconductor package manufacturing by minimizing substrate deformation and improving the glass sheet's durability.
Implementation Method 1
forming a melt-solidified surface on the end surface of the glass sheet through laser irradiation
Implementation Method 2
melting part or all of an end surface of the glass sheet by laser irradiation, followed by solidifying the part or the all of the end surface
Data Source
AI summary
A technical object of the present invention is to devise a glass sheet that is suitable for supporting a substrate to be processed to be subjected to high-density wiring and has high end surface strength, and a method of manufacturing the glass sheet, to thereby contribute to an increase in density of a semiconductor package. The glass sheet of the present invention has a total thickness variation of less than 2.0 μm, all or part of an end surface of the glass sheet including a melt-solidified surface.