Glass Substrate Stacking Structure for Reliable Laser Bonding

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Solution Overview

Problem

Existing glass substrate bonding methods for multiple substrates are inadequate, particularly in achieving strong and reliable connections between stacked substrates.

Innovation Solution

A glass substrate stacking structure that includes a basic glass substrate, multiple stacked glass substrates, and a top glass substrate, connected through conductive penetration bodies and adhesive portions formed by laser processing, allowing for sequential bonding and electrical connections between substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple glass substrates are stacked and bonded together, then the functionality and integration of the device are improved, but the bonding reliability and connection strength between substrates deteriorate

Engineering Contradiction:

Improvedevice functionalityVSAvoidbonding reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The bonding process is segmented into multiple stages: initial contact bonding, adhesive application, and laser-induced adhesive curing. This segmentation allows each bonding interface to be optimized independently, ensuring reliable connections between multiple substrates while maintaining device functionality

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An adhesive layer is introduced as an intermediary substance between glass substrates to enhance bonding reliability. The adhesive compensates for surface imperfections and thermal expansion differences, enabling strong and durable connections in stacked substrate configurations

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If conventional bonding methods are used for multiple glass substrates, then the process is simple, but the connection strength and structural integrity worsen

Engineering Contradiction:

Improveprocess simplicityVSAvoidconnection strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

Conventional mechanical or thermal bonding methods are replaced with laser-induced adhesive bonding. The laser provides precise, localized heating that activates the adhesive rapidly and uniformly, creating strong bonds without the complexity of multi-step conventional processes

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The bonding process utilizes controlled changes in temperature and energy density parameters. By adjusting laser power, pulse duration, and scanning speed, optimal bonding conditions are achieved for different substrate configurations, ensuring high connection strength while maintaining process simplicity

Inventive Principle:

Principle #35Parameter changes

3Length of stationary object

If thin glass substrates are used to reduce thickness, then the device profile is improved, but the substrate strength and bonding reliability deteriorate

Engineering Contradiction:

Improvesubstrate thicknessVSAvoidsubstrate strength

Core Design Contradiction:

Length of stationary objectVSStrength

Solution Approach 1:

The thin glass substrates are combined with adhesive materials to form a composite stacked structure. This composite approach allows each thin substrate to maintain its flexibility and miniaturization benefits while the adhesive layers provide the necessary structural strength and inter-layer bonding

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

Instead of increasing substrate thickness to improve strength, the solution moves to another dimension by stacking multiple thin substrates vertically. The adhesive layers between stacked layers provide the bonding strength that would otherwise require greater individual substrate thickness

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure enables robust connections between glass substrates, facilitating efficient electrical pathways and reliable stacking with minimal substrate thickness, enhancing the integrity and functionality of the stacked assembly.

Implementation Method 1

bonding the basic glass substrate, the plurality of stacked glass substrates, and the top glass substrate together by laser processing

Methodology Applied

Scientific EffectLaser heating: Laser

Data Source

PatentUS20250323170A1Glass substrate stacking structure and method of manufacturing the same

Publication Date: 2025.10.16 ASTI GLOBAL INC

AI summary

A glass substrate stacking structure and a method of manufacturing the same. The glass substrate stacking structure includes a basic glass substrate, a plurality of stacked glass substrates and a top glass substrate. The basic glass substrate has a basic glass adhesive portion therearound. Each stacked glass substrate has a first and a second stacked glass adhesive portion therearound. The top glass substrate has a top glass adhesive portion therearound. The basic glass substrate and the bottommost stacked glass substrate are connected to each other through the basic glass adhesive portion and the first stacked glass adhesive portion. The two adjacent stacked glass substrates are connected to each other through the first and the second stacked glass adhesive portion. The top glass substrate and the topmost stacked glass substrate are connected to each other through the top glass adhesive portion and the second stacked glass adhesive portion.