Glass Stress Test Substrate for Flexible Display Measurement

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Solution Overview

Problem

Existing methods for measuring stress in glass substrates used in flexible display apparatus manufacturing are inaccurate due to differences in physical properties between silicon wafers and glass substrates, and silicon wafers can introduce thickness-related protrusions affecting stress measurement results.

Innovation Solution

A testing device for display apparatuses includes a specimen substrate with a reflector and measurement mark, allowing for stress measurement by reflecting light off reflective patterns, and optionally using a protective film to ensure accurate stress determination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a silicon wafer specimen is disposed on a glass substrate to measure stress, then stress measurement can be performed, but the physical property differences between silicon wafer and glass substrate make it difficult to directly apply measurement results to the glass substrate

Engineering Contradiction:
Improvestress measurement accuracyVSAvoidapplicability of measurement results
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent uses a glass substrate specimen instead of a silicon wafer specimen, ensuring that the material being measured is homogeneous with the actual glass substrate in display apparatus manufacturing. This eliminates the physical property mismatch between measurement specimen and target object, making the stress measurement results directly applicable to quality control of glass substrates.

Inventive Principle:
Principle #33Homogeneity

2Measurement precision

If a silicon wafer is placed on a glass substrate with various layers, then stress measurement can be conducted, but a protrusion occurs due to the thickness of the silicon wafer which affects stress measurement results

Engineering Contradiction:
Improvestress measurement capabilityVSAvoidsurface flatness
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The patent changes the thickness parameter of the specimen substrate to be equal to or less than the thickness of the glass substrate in the display apparatus. This parameter adjustment eliminates the protrusion problem that occurs when using thicker silicon wafers, ensuring that the specimen surface remains flush with the surrounding structure for accurate stress measurement without affecting manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables precise stress measurement in glass substrates by accounting for their unique properties, reducing curvature issues and improving manufacturing quality of flexible display apparatuses.

Implementation Method 1

a reflector disposed on the specimen substrate... allowing for stress measurement by reflecting light off reflective patterns

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS20250369844A1Testing device for display apparatus and method of manufacturing display apparatus
Publication Date: 2025.12.04 SAMSUNG DISPLAY CO LTD
  • US20250369844A1 patent drawing
  • US20250369844A1 patent drawing
  • US20250369844A1 patent drawing

AI summary

A testing device which is a stress measurement specimen for a display apparatus includes a specimen substrate and a reflector disposed on the specimen substrate. The specimen substrate includes a portion of a mother substrate used to manufacture the display apparatus. A method of manufacturing the display apparatus includes testing the display apparatus using the testing device.