Glass Substrate Semiconductor Package for AiP Miniaturization
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Solution Overview
Problem
The miniaturization of wireless communication devices is hindered by the limitations of organic substrates, which are difficult to work with for fine-pitch Antenna-in-Package (AiP) systems due to thickness and process limitations, leading to increased costs and size challenges.
Innovation Solution
A semiconductor device package using a glass substrate with a conductive layer and a building-up circuit, where the glass substrate's thickness can be controlled for miniaturization, and a cavity is defined to enhance signal transmission between conductive layers through an air cavity, allowing for flexible material selection and reduced warpage issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic substrate is used in AiP system, then manufacturing is easier, but fine-pitch (less than 15/15 μm) cannot be achieved and thickness is relatively thick
Solution Approach 1:
The patent changes the substrate material from organic to glass, fundamentally altering the physical and chemical parameters of the substrate. This enables fine-pitch manufacturing (less than 15/15 μm) while allowing thickness control through selective removal processes, resolving the contradiction between ease of manufacture and fine-pitch capability.
Solution Approach 2:
The patent employs a composite structure combining glass substrate with metal layers (copper, aluminum, or alloy) and dielectric materials. This composite approach leverages the advantages of each material: glass provides dimensional stability for fine-pitch, while metal layers provide conductivity and can be selectively removed to control thickness, achieving both manufacturability and precision.
2Ease of manufacture
If organic substrate is used in AiP system, then manufacturing process is simpler, but package size cannot be reduced
Solution Approach 1:
The patent changes the substrate thickness parameter by selectively removing portions of the glass substrate to create air cavities. This thickness control enables miniaturization of the AiP system while maintaining the manufacturing simplicity of using a glass substrate, thus resolving the contradiction between ease of manufacture and package size reduction.
3Volume of moving object
If glass substrate with controlled thickness is used, then miniaturization is enabled, but manufacturing complexity increases
Solution Approach 1:
The patent segments the glass substrate by selectively removing portions to create air cavities. This segmentation approach enables thickness control and miniaturization while using standard glass manufacturing and removal techniques, managing the manufacturing complexity through modular processing steps rather than requiring entirely new manufacturing capabilities.
4Reliability
If air cavity is defined in emitting device, then signal transmission is enhanced, but manufacturing steps increase
Solution Approach 1:
The patent extracts material from the glass substrate to create air cavities, rather than adding complex structures. This extraction approach enhances signal transmission by removing dielectric material that would interfere with RF signals, while the manufacturing process uses standard etching or removal techniques integrated into existing glass substrate processing, minimizing the increase in manufacturing steps.
Data Source
AI summary
A semiconductor device package includes an emitting device and a first building-up circuit. The emitting device defines a cavity in the emitting device. The first building-up circuit is disposed on the emitting device.