Dynamic Temperature Control for Glass Substrate Baking

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Solution Overview

Problem

Conventional baking processes for glass substrates result in uneven heating due to temperature differences between contact and non-contact regions, leading to 'Mura' defects, which conventional solutions fail to prevent effectively.

Innovation Solution

An apparatus and method utilizing a temperature sensing device with multiple sensors to dynamically control heating and cooling of support components to maintain uniform temperature across the glass substrate, ensuring consistent heating and preventing deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If support pins are made of better heat-insulating material, then temperature difference between contact and non-contact regions is reduced, but thermal conductivity difference still exists causing Mura defect

Engineering Contradiction:

Improvetemperature uniformityVSAvoidMura defect prevention

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent changes the thermal parameter of the support component by actively controlling its temperature through heating and cooling devices, transforming it from a passive heat-insulating component to an actively temperature-regulated component. This dynamic parameter adjustment compensates for thermal conductivity differences and prevents Mura defects.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent implements a feedback control system where temperature sensors continuously monitor the temperature of the support component and glass substrate, and the controller adjusts the heating and cooling devices accordingly. This closed-loop feedback ensures temperature uniformity is maintained throughout the baking process.

Inventive Principle:

Principle #23Feedback

2Reliability

If support pins are controlled to alternately support the glass substrate, then contact time is reduced, but pressure on contact regions becomes too large causing deformation and Mura defect

Engineering Contradiction:

ImproveMura defect preventionVSAvoidcontact pressure

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

The patent changes the temperature parameter of the support component to match the glass substrate temperature, which reduces thermal stress and prevents deformation. This parameter adjustment allows continuous support without the need for alternating support schemes.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

Instead of alternating the support pins to reduce contact time, the patent inverts the approach by maintaining continuous support through multiple components while actively controlling their temperature to prevent deformation and Mura defects.

Inventive Principle:

Principle #13The other way round (Inversion)

3Ease of operation

If needlelike support pins are used, then support function is achieved, but flatness of glass substrate cannot be maintained causing halo Mura defect

Engineering Contradiction:

Improvesupport functionVSAvoidflatness

Core Design Contradiction:

Ease of operationVSShape

Solution Approach 1:

The patent changes the temperature parameter of the support component to prevent thermal deformation, which maintains the flatness of the glass substrate even when using needlelike support structures. The active temperature control compensates for the geometric limitations of pin-shaped supports.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses a composite support system combining multiple needlelike support pins with active temperature control devices, creating a composite structure that maintains both the support function and the flatness of the glass substrate through coordinated thermal management.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents 'Mura' defects by ensuring uniform temperature distribution across the glass substrate, reducing the likelihood of pin-induced and halo defects, and maintaining flatness during the baking process.

Implementation Method 1

The baking oven heats the glass substrate through an infrared heater

Methodology Applied

Scientific EffectInfrared radiation: Infrared Radiation

Implementation Method 2

there is a difference of thermal conductivity existed between a contact region (contact area of support components on the glass substrate) and a noncontact region

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9206065B2Apparatus and method for baking glass substrate

Publication Date: 2015.12.08 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD

AI summary

The present invention discloses an apparatus for baking a glass substrate, which includes: a baking oven, a support component, a temperature sensing device, a heating device, a cooling device, and a temperature controlling device. The present invention further discloses a method for baking a glass substrate. The present invention is capable of dynamically controlling the temperature of the support component, which contacts the glass substrate. The temperature of the glass substrate keeps identical and the temperature of the support component keep identical, so as to prevent a Mura defect appearing on the glass substrate.