Glass Packaging Substrate Cavity Frame for Heat and Signal Routing
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Solution Overview
Problem
Existing semiconductor packaging technologies do not adequately support the electrical performance of high-performance and high-frequency semiconductor elements due to limitations in conductive line pitches and heat dissipation, with ceramic substrates having high resistance and resin substrates facing pitch reduction limitations, and glass substrates prone to bending and defects during miniaturization.
Innovation Solution
A packaging substrate featuring a glass substrate with a cavity frame and frame through holes, allowing for improved heat dissipation and mechanical and electrical properties, utilizing a core via and core distribution layer for efficient electrical connection and a cavity element for enhanced signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a ceramic substrate is used for packaging, then mechanical strength is improved, but electrical performance deteriorates due to high resistance and high dielectric constant
Solution Approach 1:
The patent employs a composite structure combining glass substrate with metal through-holes and conductive materials. The glass substrate provides mechanical support while the metal components provide electrical conductivity, creating a composite system that achieves both mechanical strength and electrical performance requirements.
2Reliability
If a resin substrate is used for packaging, then electrical performance is improved, but manufacturing precision deteriorates due to limitation in pitch reduction of conductive lines
Solution Approach 1:
The patent transitions from planar conductive lines to three-dimensional through-holes penetrating the substrate. This dimensional change allows electrical connections to be made vertically through the substrate rather than laterally along the surface, enabling pitch reduction without being constrained by the substrate material's line formation capabilities.
3Reliability
If glass substrate is used for packaging, then electrical performance is improved, but mechanical stability deteriorates due to bending and defects during miniaturization
Solution Approach 1:
The patent creates a composite structure where glass substrate is combined with metal through-holes and supporting cavity frames. The metal components and frame structure provide mechanical reinforcement to the glass substrate, compensating for its susceptibility to bending and defects during miniaturization processes while preserving the electrical performance benefits.
4Ease of manufacture
If conventional packaging substrate is used, then manufacturing simplicity is maintained, but heat dissipation capability deteriorates
Solution Approach 1:
The patent utilizes through-holes penetrating the substrate that can be filled with conductive materials, creating thermal conduction pathways similar to hydraulic conduits. These vertical thermal pathways efficiently conduct heat away from the mounted device, significantly improving heat dissipation capability while maintaining manufacturing feasibility through established via-filling processes.
Data Source
AI summary
Disclosed are a packaging substrate comprising a glass substrate comprising a first surface and a second surface which is the opposite surface of the first surface; a cavity unit forming a space inside the glass substrate; a cavity frame dividing the space into plural districts; and a cavity element comprised in at least some of the cavity unit, wherein the cavity frame comprises plural frame through holes penetrating in a direction from the one side to the other side.