Glass Substrate Chamfering Edge Chipping Prevention
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Solution Overview
Problem
Conventional methods for manufacturing glass substrates for magnetic disks face issues with chipping during the chamfering process, leading to increased material loss, longer processing times, and higher costs due to the need for extensive lapping and polishing to remove chipping, which is not effectively prevented by existing techniques.
Innovation Solution
A method involving the formation of a glass block by stacking and integrating thin glass plates, followed by coring to create an annular shape, grinding the surfaces, separating and cleaning the annular glass substrates, and chamfering the edges using specialized grindstones with curved inclined surfaces to minimize chipping and reduce machining allowances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional chamfering methods are used on thin glass substrates, then edge portions can be chamfered, but chipping occurs from the chamfered portion toward the main surface
Solution Approach 1:
The patent applies preliminary grinding to the edge portions before chamfering. The grinding step removes surface irregularities and creates a uniform edge geometry that prevents chipping during subsequent chamfering operations. This preliminary action eliminates the need for extensive post-chamfering lapping and polishing.
Solution Approach 2:
The patent extracts the problematic step of extensive lapping and polishing by eliminating the source of chipping through preliminary grinding. By removing the cause (surface irregularities) before chamfering, the harmful effect (chipping) is prevented, making subsequent removal steps unnecessary.
2Manufacturing precision
If extensive lapping and polishing are performed to remove chipping, then surface quality improves, but manufacturing time and material loss increase
Solution Approach 1:
The patent performs preliminary grinding before chamfering to create uniform edge geometry and eliminate surface irregularities that would otherwise require extensive lapping and polishing. This preliminary action ensures high surface quality is achieved during the chamfering process itself, not afterward.
Solution Approach 2:
The patent skips the traditional extensive lapping and polishing steps by preventing chipping in the first place through preliminary grinding. The process moves directly from preliminary grinding to chamfering to polishing, eliminating intermediate removal steps and significantly reducing manufacturing time.
3Manufacturing precision
If machining allowance is increased to account for chipping removal, then chipping can be removed, but material loss and cost increase
Solution Approach 1:
The patent applies preliminary grinding to create uniform edge geometry before chamfering, which prevents chipping occurrence. This eliminates the need for large machining allowances, as the glass substrate dimensions can be closely controlled to the final specifications without requiring additional material for chipping removal.
4Manufacturing precision
If thin glass substrates with mirror-finished surfaces are used, then surface quality improves, but chipping becomes more likely during chamfering
Solution Approach 1:
The patent applies preliminary grinding to thin glass substrates with mirror-finished surfaces before chamfering. This preliminary action creates uniform edge geometry and removes surface irregularities that would otherwise cause stress concentration and chipping during chamfering of thin, high-quality substrates.
Solution Approach 2:
The preliminary grinding step acts as a cushioning measure that prevents chipping before it occurs during chamfering. By preparing the edge geometry in advance, the substrate is protected against the harmful effects of chamfering on thin, mirror-finished surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces chipping occurrence and depth, minimizing material loss and processing time, thereby lowering manufacturing costs while maintaining high surface quality and precision.
Implementation Method 1
grinding an edge portion of the glass substrate with a grindstone having a curved inclined surface
Data Source
AI summary
A glass block is formed by stacking, fixing, and integrating a plurality of thin glass plates having a predetermined thickness. An annular glass block is formed by coring the glass block. Surfaces of an inside circumference and an outside circumference of the annular glass block are ground. The annular glass block of which the surfaces of the inside circumference and the outside circumference are ground are separated into individual annular glass substrates, and separated annular glass substrates are cleaned. Then, edge portions of the inside circumference and the outside circumference of a cleaned annular glass substrate are chamfered.