Glass Substrates With Partially Embedded Conductive Layers
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Solution Overview
Problem
Traditional semiconductor package substrates face challenges in maintaining stable power delivery and signal transmission as they become thinner, leading to warping, increased resistivity, and compromised signaling performance due to the compromise between power trace thickness and signaling trace thickness.
Innovation Solution
The use of a glass substrate with partially embedded conductive layers, where power lines extend in multiple layers while signaling lines remain in a single build-up layer, and trenches in the glass substrate filled with conductive material to increase power delivery thickness without affecting signaling performance, allowing for optimized power delivery without interfering with signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the substrate is made thinner to reduce package size, then the package profile is reduced, but the substrate becomes susceptible to warping and bending
Solution Approach 1:
The patent applies local quality by providing recessed channels only in specific regions where power traces are located, rather than uniformly across the entire substrate. This allows the power trace regions to have increased effective thickness for stability, while other regions maintain the reduced overall substrate thickness for compact packaging.
Solution Approach 2:
The patent introduces a vertical dimension solution by creating recessed channels that extend into the substrate thickness, then filling them with conductive material. This effectively adds thickness in the vertical dimension at critical power delivery locations, counteracting warping without increasing the overall substrate footprint.
2Power
If the power trace thickness is increased to improve power delivery, then the power delivery capacity is improved, but the signaling trace thickness must be compromised
Solution Approach 1:
The patent segments the substrate into distinct regions: power trace regions with recessed channels for enhanced power delivery, and signal trace regions without recessed channels maintaining standard signaling performance. This segmentation allows independent optimization of power and signal trace characteristics.
Solution Approach 2:
The recessed channels are provided locally only where power traces are positioned, allowing increased power delivery capacity in those specific areas without affecting the thickness or performance of signaling traces in other areas.
3Volume of moving object
If the overall substrate thickness is reduced for compact packaging, then the package profile is smaller, but the resistivity increases and power delivery is compromised
Solution Approach 1:
The patent solves the thickness-resistivity dilemma by utilizing the vertical dimension through recessed channels that extend into the substrate. This creates additional conductive pathways in the depth direction, effectively increasing the power delivery cross-section without increasing the overall substrate thickness.
Solution Approach 2:
The patent employs a composite structure combining the substrate material with embedded conductive material in recessed channels. This composite approach enhances power delivery capability by adding highly conductive material in strategic locations while maintaining the overall thin substrate profile.
Data Source
AI summary
Glass layers having partially embedded conductive layers for power delivery in semiconductor packages and related methods are disclosed. An example semiconductor package includes a core layer having a thickness between a first surface opposite a second surface. The core layer includes a trench provided in the first surface. The trench partially extending between the first surface and the second surface. An electrically conductive material is positioned in the trench. A trace is provided on the conductive material. The trace is offset in a direction away from the first surface and away from the second surface of the core layer.