Glass Substrate Embedding via Patterned Mold Flow
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Solution Overview
Problem
Existing methods for forming electronic feedthroughs or vias in glass substrates face challenges such as insufficient spatial resolution, damage to the glass, limitations in hole size, and fragility, making it difficult to achieve thin glass substrates with embedded materials while maintaining adequate bonding and flow into recesses smaller than 100 μm.
Innovation Solution
A method involving a mold substrate with a patterned surface of higher reflow temperature than the glass composition, where the surface wettability is increased to promote complete bonding and flow of the glass composition into recesses, allowing for the embedding of material and achieving thinner glass substrates without fracturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional glass molding techniques are used, then batch mode processing is achieved, but spatial resolution and repeatability are insufficient
Solution Approach 1:
The patent replaces traditional mechanical drilling and molding techniques with a flow-based glass filling process. Glass is heated to a flowable state and allowed to naturally flow into recesses defined on a substrate, eliminating the need for mechanical contact during hole formation. This substitution enables precise spatial resolution through patterned recesses while maintaining batch processing capability, resolving the contradiction between precision and manufacturability.
2Manufacturing precision
If electroplating or drilling processes are used to create feedthroughs, then vertical vias can be formed, but glass damage and surface alteration occur
Solution Approach 1:
The patent eliminates mechanical drilling and electroplating processes by using a thermal flow approach. Glass is heated above its transition temperature to become flowable, then allowed to fill recesses through capillary action and pressure differential. This non-contact, thermal-based process avoids mechanical stress, surface scratching, and thermal shock that damage glass in traditional methods, achieving precise via formation without harmful effects.
Solution Approach 2:
The patent utilizes the phase transition of glass from solid to flowable state by heating above its transition temperature. This temporary phase change allows the glass to flow into recesses and conform to precise patterns without mechanical force. After filling, the glass is cooled and resolidifies, capturing the desired geometry. This phase transition enables precise feature formation while avoiding the damage associated with mechanical or electrochemical processes.
3Length of moving object
If glass substrates are thinned to reduce size, then miniaturization is achieved, but structural integrity and adhesion are compromised
Solution Approach 1:
The patent performs preliminary bonding of the glass to the substrate before thinning operations. The glass is flowably applied to the substrate and bonded in place while maintaining full thickness and structural support. Only after this secure bonding is established are subsequent thinning steps performed. This preliminary action ensures that even when the glass is thinned to minimal thickness, the adhesion remains intact because the bonding occurred when the glass was more robust and could better withstand the bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of glass substrates with embedded materials that can be thinned to unprecedented thicknesses without fracturing and allows for complete filling of recesses smaller than 100 μm, enhancing the miniaturization of electronic microsystems while maintaining structural integrity.
Implementation Method 1
heating the glass composition to a temperature at which the glass composition becomes flowable
Implementation Method 2
flows into the recesses with the aid of vacuum pressure in the recesses, which acts to draw the glass into the recesses
Implementation Method 3
increasing a surface wettability of the patterned surface relative to the glass composition
Implementation Method 4
solidifying the glass composition on the patterned surface of the mold substrate to form a solidified glass layer
Data Source
AI summary
A method of embedding material in a glass substrate is provided. The method includes providing a glass composition and a mold substrate having a patterned surface defining a recess therein. The mold substrate is formed from a material having a higher reflow temperature than the glass composition. A surface wettability of the patterned surface is increased relative to the glass composition. At least a portion of the glass composition is flowed into the recess defined by the patterned surface of the mold substrate, followed by solidifying the glass composition to form a solidified glass layer. Material is removed from the solidified glass layer until a portion of the underlying patterned surface of the mold substrate is exposed with at least a portion of the mold substrate embedded in the solidified glass layer to thereby form the glass substrate having the material embedded therein.