Ultra-thin Glass Substrate Etching for Edge Integrity
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Solution Overview
Problem
The manufacturing of ultra-thin glass substrates faces challenges in achieving a straight edge during cutting, as scribing wheel cutting is limited to linear cuts and can cause edge breakages and microcracks, while laser cutting may result in irregular cuts and quality defects due to scattering, and the application of a protection ink layer is difficult to apply uniformly.
Innovation Solution
A method involving a glass base material with preset substrate areas and a skeleton area, where an etching protection layer is formed on both surfaces, the skeleton area is etched to separate the substrate areas and form a stress dissipation edge, and the protection layer is removed to produce independent glass substrates, eliminating the need for scribing wheels and lasers and enhancing edge flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If scribing wheel cutting is used to cut ultra-thin glass substrate, then linear cutting can be achieved, but edge breakages and microcracks occur due to mechanical pressure
Solution Approach 1:
The patent replaces the mechanical scribing wheel cutting system with a laser cutting system that uses optical energy instead of mechanical force. The laser beam melts and evaporates the glass material along the cutting path without applying pressure, thereby eliminating edge breakages and microcracks caused by mechanical contact while maintaining cutting precision
Solution Approach 2:
The laser cutting process utilizes phase transitions of glass material from solid to liquid and then to vapor. The laser energy heats the glass along the cutting path, causing it to melt and evaporate, creating a clean cut edge without mechanical stress that would cause defects
2Reliability
If laser cutting is used to cut ultra-thin glass substrate, then no mechanical pressure is applied, but cutting quality deteriorates due to laser scattering and irregular cuts
Solution Approach 1:
The patent applies a protective ink layer on the surface of the ultra-thin glass substrate before laser cutting. This preliminary action prevents laser scattering by providing a surface that absorbs and guides the laser energy along the intended cutting path, ensuring regular and precise cuts while maintaining edge integrity
Solution Approach 2:
The protective ink layer serves as an intermediary between the laser beam and the glass surface. It mediates the laser-glass interaction by controlling laser energy absorption and distribution, preventing direct laser scattering on the glass surface while enabling precise cutting through the glass material
3Object-affected harmful factors
If protection ink layer is sprayed on ultra-thin glass substrate, then surface protection is provided, but uniform application is difficult due to bubbles and thickness variations
Solution Approach 1:
The patent replaces the mechanical spray coating system with a dip coating system where the ultra-thin glass substrate is immersed in a protective ink solution. This method uses fluid dynamics rather than mechanical spraying, allowing the ink to uniformly coat the surface by capillary action and gravity, eliminating bubbles and thickness variations caused by spray instability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method prevents damage from scribing wheel and laser cutting, simplifies the manufacturing process, accelerates processing speed, and improves the quality of ultra-thin glass substrates by forming stress dissipation edges, ensuring better edge integrity and flexibility.
Implementation Method 1
The laser cutting means uses the energy released when laser beam irradiates on a surface of a workpiece to melt and evaporate a part of the workpiece
Implementation Method 2
The laser cutting means uses the energy released when laser beam irradiates on a surface of a workpiece to melt and evaporate a part of the workpiece
Implementation Method 3
at least etching the skeleton area of the glass base material to separate the substrate area from the glass base material
Data Source
AI summary
A method for manufacturing an ultra-thin glass substrate includes: providing a glass base material preset with n substrate areas and a skeleton area surrounding the substrate areas; at least forming an etching protection layer on an upper surface and a lower surface of each substrate area of the glass base material, respectively; at least etching the skeleton area of the glass base material to separate the substrate areas from the glass base material, and form a stress dissipation edge along an edge of each substrate area; and removing the etching protection layer to get independent glass substrates. A method for manufacturing a display panel is also disclosed. An aim is to prevent quality of the ultra-thin glass substrate from damage caused by scribing wheel cutting or laser cutting, therefore the quality of the ultra-thin glass substrate is improved.