Glass Substrate Frame Structure for Crack-Resistant Chip Assembly
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Solution Overview
Problem
Glass substrates used in semiconductor devices, such as CMOS image sensors, are prone to cracking or chipping during transportation and assembly, which compromises the reliability of the semiconductor device.
Innovation Solution
A semiconductor device design that includes a glass substrate with a frame covering the outer edge and a material film to protect the glass substrate, featuring a frame extending beyond the substrate's edges and a material film that covers the substrate's edges and wiring, with additional features like holes and protrusions to prevent adhesive overflow and improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a glass substrate is used as a semiconductor substrate, then high surface flatness and optical properties are achieved, but the glass substrate is prone to cracking or chipping during transportation and assembly
Solution Approach 1:
The patent applies beforehand cushioning by providing a frame structure that extends beyond the edges of the glass substrate and a material film that covers the surface. These protective structures are prepared in advance to absorb and distribute stress before it reaches the glass substrate, preventing cracking and chipping during transportation and assembly while maintaining the optical properties of the glass substrate
2Reliability
If a frame is added to protect the glass substrate edges, then cracking resistance is improved, but device complexity increases
Solution Approach 1:
The frame structure serves multiple functions simultaneously: it protects the edges of the glass substrate from cracking, provides structural support, and helps maintain the overall integrity of the device. This multi-functionality reduces the need for additional separate protective components, thereby limiting the increase in device complexity while improving cracking resistance
3Stress or pressure
If a material film is applied between the glass substrate and frame, then stress distribution is improved, but manufacturing precision requirements increase
Solution Approach 1:
The material film changes the physical parameters of the interface between the glass substrate and frame, providing stress distribution and cushioning effects. By selecting materials with appropriate mechanical properties and controlling the film thickness within a reasonable range, the patent achieves stress distribution without requiring extremely high manufacturing precision
Data Source
AI summary
There is provided a semiconductor device that can reduce a stress to be applied to a glass substrate, and sufficiently protect end parts of the glass substrate. A semiconductor device according to the present disclosure includes: a glass substrate that includes a first face, a second face on a side opposite to the first face, and a first side face between the first face and the second face; a semiconductor chip that is provided on the first face; a frame that includes a first facing face facing an outer edge part of the first face, and a second facing face facing the first side face; and a first material film that is provided at least partially between the glass substrate and the frame.