Glass Packaging Substrate Insulation Layout for Cavity Gap Isolation
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Solution Overview
Problem
The existing packaging technologies for semiconductor devices face challenges in reducing the undulation phenomenon caused by gaps between cavity elements and between the cavity portion and the cavity element, which can lead to leakage currents and defects in the packaging substrate.
Innovation Solution
A packaging substrate manufacturing method that involves forming a first insulating layer on the surfaces of the cavity element, except for the upper or bottom surface, and a second insulating layer on the glass substrate, with both layers having different dielectric constants to prevent short circuits and undulation phenomena.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a glass substrate is used for high-end packaging, then electrical characteristics improve and line length shortens, but undulation phenomenon occurs due to gaps between cavity elements and between cavity portion and cavity element
Solution Approach 1:
An insulating layer is introduced as an intermediary substance between the cavity element and the glass substrate, and between adjacent cavity elements. This insulating layer fills the gaps and prevents direct contact, thereby eliminating the undulation phenomenon while maintaining the electrical characteristics provided by the glass substrate structure.
Solution Approach 2:
The dielectric constant of the insulating layer is specifically controlled to be lower than that of the glass substrate (Dk difference of 0.1 or more). This parameter change in dielectric constant compensates for the gaps and prevents signal interference, resolving the undulation issue while preserving the electrical performance benefits of the glass substrate.
2Adaptability or versatility
If cavity elements are disposed in cavity portion of glass substrate, then packaging functionality is achieved, but gaps cause undulation phenomenon and leakage currents
Solution Approach 1:
The insulating layer serves as a mediator between cavity elements and the glass substrate, preventing direct electrical contact through gaps. This eliminates leakage current paths while maintaining the packaging functionality of housing cavity elements within the glass substrate structure.
Solution Approach 2:
The insulating layer is selectively applied in specific locations where gaps occur - between adjacent cavity elements and between the cavity portion and cavity elements. This localized application provides targeted electrical isolation where needed, preventing leakage currents without compromising the overall packaging functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed method effectively prevents the undulation phenomenon and leakage currents, improving the quality and reliability of the packaging substrate by ensuring proper insulation and reducing defects.
Implementation Method 1
a first insulating layer which is formed on some surfaces other than one surface or on all the surface of the cavity element and a second insulating layer which is incorporated into the remaining portion of the cavity portion other than the cavity module, and the first insulating layer and the second insulating layer have different dielectric constants
Data Source
Figure 1~2
Figure 3(a)~3(b)
Figure 4(a)~4(e)
AI summary
The present specification relates to a method of manufacturing a packaging substrate and a packaging substrate manufactured thereby. The packaging substrate according to the present specification includes a core layer including a glass substrate having a first surface and a second surface facing each other and a cavity portion passing through the glass substrate, wherein a cavity module is disposed in the cavity portion, the cavity module comprise a cavity element and a first insulating layer is formed on some surfaces other than one surface or on all the surface of the cavity element, and a second insulating layer is incorporated into the remaining portion of the cavity portion other than the cavity module, and the first insulating layer and the second insulating layer have different dielectric constants. Accordingly, an undulation phenomenon due to a gap between elements, a gap between the cavity portion and an element, and/or the like may be prevented, and a leakage current may be prevented from occurring.