Glass Substrate Heat Dissipation Part for Semiconductor Devices
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Solution Overview
Problem
Heat pipes made of metal materials used in wiring substrates for high-frequency and high-speed communication modules often cause fluctuations in high-frequency characteristics, such as variations in line characteristics or decreased antenna sensitivity.
Innovation Solution
A semiconductor device is developed with a glass substrate adhered to a wiring layer-attached glass substrate, featuring a heat dissipation part formed between them, which includes a cavity structure with a coolant sealed within, functioning as a heat pipe to enhance heat dissipation without affecting high-frequency characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal heat pipe is used in a wiring substrate, then heat dissipation capacity is improved, but high-frequency characteristics deteriorate due to fluctuations such as variation in line characteristics or decreased antenna sensitivity
Solution Approach 1:
The patent extracts the heat pipe from the wiring substrate layer and places it in a separate glass substrate. This separation removes the harmful metal heat pipe from the high-frequency signal path while maintaining its heat dissipation function through the adhesive layer interface.
Solution Approach 2:
The patent introduces an adhesive layer as an intermediary between the wiring substrate and the glass substrate containing the heat pipe. This adhesive layer serves as a thermal interface material that transfers heat from the wiring substrate to the heat pipe while electrically isolating the metal heat pipe from the high-frequency circuits.
2Temperature
If a metal heat pipe is attached to the wiring substrate, then heat dissipation is enhanced, but manufacturing complexity increases due to additional attachment processes
Solution Approach 1:
The patent merges the heat pipe attachment process with the glass substrate bonding process. The heat pipe is embedded in the glass substrate before bonding to the wiring substrate, allowing both operations to be performed in one sequence rather than as separate steps.
Solution Approach 2:
The adhesive layer serves multiple functions simultaneously: it bonds the glass substrate to the wiring substrate, provides thermal interface material for heat transfer, and acts as an electrical insulator. This multi-functionality reduces the need for additional specialized components or processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances heat dissipation capacity while maintaining stable high-frequency characteristics, suitable for high-frequency and high-speed communication modules.
Implementation Method 1
a heat dissipation part that is formed between the wiring layer-attached glass substrate and the glass substrate
Data Source
AI summary
The present technology relates to a semiconductor device that makes it possible to enhance a heat dissipation capacity without occurrence of a fluctuation in high frequency characteristics. A glass substrate is adhered to a wiring layer-attached glass substrate, and a heat dissipation part is formed between the wiring layer-attached glass substrate and the glass substrate. The present disclosure is applicable to, for example, a high-frequency module and a high-speed communication module.