Glass Packaging Substrate Layout for Low-Loss High-Frequency Signals
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving sufficient adhesive strength and minimizing power loss, especially when high-frequency signals are applied, due to the surface roughness of conductive layers which can lead to increased resistance and inefficient signal transmission.
Innovation Solution
A packaging substrate with a glass substrate and patterned metal layers, where the first upper redistribution layer has a fine wire with low surface roughness and a specific thickness ratio, and a second upper redistribution layer with a thicker wire, both connected by blind vias, and an insulating material with a polysilane layer for chemical bonding, ensuring strong adhesion without surface etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the surface roughness of electrically conductive layers is increased to improve adhesive strength, then adhesive strength between dielectric material layers and conductive layers is improved, but power loss increases and signal transmission efficiency decreases due to increased resistance
Solution Approach 1:
The patent applies different surface roughness characteristics to different conductive layers based on their functional requirements. The first upper redistribution layer (thinner layer) maintains low surface roughness to minimize power loss and ensure efficient high-frequency signal transmission, while the second upper redistribution layer (thicker layer) has increased surface roughness to provide strong adhesive strength for mechanical support. This local differentiation resolves the contradiction by optimizing each layer's surface properties according to its specific role in the packaging substrate.
2Loss of energy
If a thicker conductive layer is used to reduce resistance and power loss, then electrical conductivity is improved, but adhesive strength decreases due to reduced surface area for bonding
Solution Approach 1:
The patent implements a dual-layer conductive structure where the first upper redistribution layer is designed with smaller thickness to minimize resistance and power loss for high-frequency signals, while the second upper redistribution layer is designed with larger thickness to provide sufficient adhesive strength and mechanical support. Each layer's thickness is optimized locally according to its specific function, resolving the contradiction between electrical conductivity and adhesive strength.
3Strength
If surface etching is applied to increase surface roughness for better adhesion, then adhesive strength is improved, but resistance increases due to creation of mechanical anchoring sites
Solution Approach 1:
The patent selectively applies surface roughness treatment only to the second upper redistribution layer which requires strong adhesive strength for mechanical support, while the first upper redistribution layer maintains a smooth surface to minimize resistance and ensure reliable high-frequency signal transmission. This localized application of surface treatment resolves the contradiction between adhesion and signal transmission efficiency.
Solution Approach 2:
The patent divides the conductive layers into two separate upper redistribution layers with distinct surface roughness characteristics. The first layer is kept smooth for electrical performance, while the second layer is roughened for mechanical bonding. This segmentation allows each layer to independently optimize its properties without compromising the other, resolving the contradiction between adhesive strength and signal transmission reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances adhesive strength and reduces power loss, enabling efficient signal transmission even at high frequencies by maintaining low resistance and preventing mechanical anchoring sites that could increase resistance.
Implementation Method 1
an insulating material with a polysilane layer for chemical bonding, ensuring strong adhesion
Data Source
AI summary
An electronic element packaging substrate and manufacturing method are provided. The substrate includes finer wire widths, transmits signals with low resistance, and provides a compact electronic element package. The substrate may be driven with high efficiency even when high frequency power is applied thereto.