Glass Substrate Hole Formation via Laser and Wet Etching
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Solution Overview
Problem
The existing methods for manufacturing glass substrates with holes, such as through holes, often result in deviations from the desired thickness and size, leading to reduced yield rates and increased manufacturing costs due to the need for additional processing steps and equipment variations.
Innovation Solution
A method involving setting the initial thickness of a glass plate, forming initial characteristic objects using laser irradiation, and adjusting the thickness through wet etching to achieve the desired hole size and substrate thickness, while maintaining high yield rates and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the through hole is formed in advance with a size close to the predetermined size, then the hole size is close to desired, but a crack is likely to be generated and yield rate is lowered
Solution Approach 1:
The method performs preliminary action by forming an initial characteristic object or through hole that is intentionally larger than the final desired size. This preliminary oversized hole reduces stress concentration during the forming process, preventing cracks while allowing subsequent wet etching to precisely achieve the target hole size with high yield rate.
Solution Approach 2:
The method applies beforehand cushioning by creating an oversized initial hole that provides a buffer margin. This cushioning effect prevents crack generation during hole formation by reducing stress concentration, while the excess material is subsequently removed by controlled wet etching to achieve the precise final dimensions with high reliability.
2Manufacturing precision
If additional processing steps are added to control thickness, then thickness precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The method merges two functions into a single wet etching process: (1) reducing the hole size from the initial oversized dimension to the final desired size, and (2) controlling the substrate thickness to remain within the predetermined range. This merging eliminates the need for separate thickness control steps, maintaining high thickness precision while reducing device complexity and manufacturing cost.
Solution Approach 2:
The wet etching process is given multi-functionality by making it simultaneously responsible for both hole size adjustment and thickness control. This universal approach allows a single process step to achieve multiple objectives, improving thickness precision without increasing the number of processing steps or overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the precise manufacturing of glass substrates with desired hole sizes and thicknesses, minimizing thickness deviations and increasing yield rates, thereby improving manufacturing efficiency and reducing costs.
Implementation Method 1
forming one initial characteristic object or two or more initial characteristic objects in the glass plate by irradiating the glass plate with a laser from a side of the first surface of the glass plate
Implementation Method 2
performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having the diameter φf on the first surface is formed
Data Source
AI summary
A manufacturing method of a glass substrate with a hole having a diameter ϕf, and with a thickness θf includes setting a thickness θ1 of a glass plate that is to be processed; preparing a glass plate with the thickness θ1, having first and second surfaces opposite to each other; forming one initial characteristic object or two or more initial characteristic objects in the glass plate by irradiating the glass plate with a laser from a side of the first surface of the glass plate, the initial characteristic object having a size of a diameter ϕ1 on the first surface; and performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having the diameter ϕf on the first surface is formed, and a thickness of the glass plate is adjusted from θ1 to a target value of θf.