Glass Substrate Hole Positioning via Dummy Substrate Deviation Compensation
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Solution Overview
Problem
Existing methods for forming holes in glass substrates, such as through-holes, often result in positional deviations after heat treatment, which is critical in semiconductor devices requiring high accuracy.
Innovation Solution
A manufacturing method involving a dummy glass substrate to measure and account for deviations caused by both laser processing and heat treatment, ensuring accurate hole placement by adjusting irradiation positions and heat treatment conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a through-hole is formed in a glass substrate by laser irradiation followed by heat treatment, then residual stress and warpage are relieved, but the position of the through-hole deviates from the predetermined position
Solution Approach 1:
The patent applies preliminary action by performing a test laser irradiation and heat treatment on a dummy glass substrate before processing the actual glass substrate. This preliminary experiment determines the deviation amount caused by heat treatment, which is then used to correct the irradiation position in advance. By predicting and compensating for the deviation before actual production, the method ensures high positioning accuracy while still performing necessary heat treatment to relieve residual stress.
Solution Approach 2:
The patent changes the irradiation position parameter based on the deviation amount determined from preliminary experiments. Specifically, the irradiation position is shifted by the measured deviation amount in the opposite direction of the expected deviation, so that after heat treatment, the through-hole ends up at the predetermined position. This parameter adjustment resolves the contradiction between performing heat treatment for stress relief and maintaining positioning accuracy.
2Reliability
If heat treatment is performed on glass substrate after through-hole formation, then influence of residual stress is relieved, but through-hole position deviates from target position
Solution Approach 1:
The patent performs preliminary heat treatment experiments on dummy substrates to determine the exact deviation amount caused by heat treatment before actual production. This preliminary action allows the system to predict how much the through-hole position will shift during heat treatment and compensate for it in advance by adjusting the laser irradiation position, thereby maintaining both structural stability and positioning accuracy.
Solution Approach 2:
The patent implements feedback by using the deviation amount measured from preliminary experiments to adjust and correct the irradiation position for actual glass substrates. The system feeds back the learned deviation pattern from dummy substrate processing into the positioning control for production substrates, creating a closed-loop system that maintains high accuracy despite the unavoidable position shift caused by heat treatment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures holes are accurately positioned on the glass substrate even after heat treatment, addressing the issue of positional deviations and enhancing precision in semiconductor and interposer substrate manufacturing.
Implementation Method 1
irradiating a plurality of hole formation target positions of a dummy glass substrate with a laser under a first condition, to form a plurality of holes in the dummy glass substrate
Implementation Method 2
a heat treatment is performed on the glass substrate after the processing to relieve the influence of the residual stress and/or warpage
Data Source
AI summary
A manufacturing method of a glass substrate having holes includes irradiating a plurality of hole formation target positions of a dummy glass substrate with a laser under a first condition, to form a plurality of holes in the dummy glass substrate; heating the dummy glass substrate under a second condition; measuring, for each of the hole formation target positions, a deviation between the hole formation target position and a position of the hole after the heating formed by irradiating the hole formation target position of the dummy glass substrate; irradiating irradiation target positions of a glass substrate, having substantially same shape, dimension and composition as the dummy glass substrate, with a laser under the first condition, to form a plurality of holes, the irradiation target positions of the glass substrate with the laser being determined taking into account the deviation; and heating the glass substrate under the second condition.