Horizontal Glass Substrate Packaging with Interleaved Slip Sheets

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Solution Overview

Problem

The existing packaging method for disc-shaped glass substrates, which requires increasing the number of holding guides and hole portions as the number of substrates increases, leads to higher manufacturing costs and risks breakage due to vertical stacking and stress on the substrates' outer peripheral ends.

Innovation Solution

Packaging disc-shaped glass substrates in a horizontal posture with protective sheets interposed between them, reducing packaging costs and minimizing stress on the substrates' edges, thereby preventing breakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the number of holding guides and hole portions is increased to accommodate more disc-shaped glass substrates, then the packaging capacity is improved, but the manufacturing cost of the substrate accommodating container increases

Engineering Contradiction:
Improvepackaging capacityVSAvoidmanufacturing cost
Core Design Contradiction:
Quantity of substanceVSEase of manufacture

Solution Approach 1:

The patent inverts the conventional vertical stacking approach by adopting horizontal stacking of disc-shaped glass substrates. This inversion eliminates the need for complex holding guides and hole portions, allowing substrates to be stacked directly without additional structural components, thereby maintaining packaging capacity while reducing manufacturing cost

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent extracts and removes the holding guides and hole portions from the packaging structure. By eliminating these unnecessary components in favor of direct horizontal stacking, the design simplifies the container structure and reduces manufacturing complexity while still achieving the required packaging capacity

Inventive Principle:
Principle #2Taking out (Extraction)

2Quantity of substance

If disc-shaped glass substrates are arranged in a vertical posture to save space, then the packaging density is improved, but the outer peripheral end portions are subjected to excessive stress and may break

Engineering Contradiction:
Improvepackaging densityVSAvoidsubstrate integrity
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent inverts the stacking orientation from vertical to horizontal. This inversion changes the stress distribution pattern, allowing the substrates to rest on their larger surface area rather than their vulnerable outer peripheral end portions, thereby preventing breakage while maintaining packaging density through efficient horizontal layering

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent implements protective sheets between stacked substrates as a form of beforehand cushioning. These sheets prevent direct contact and stress concentration at vulnerable points, providing protective buffering that prevents breakage during handling and transport while maintaining the space-efficient stacked arrangement

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS10173833B2Glass substrate package
Publication Date: 2019.01.08 NIPPON ELECTRIC GLASS CO LTD
  • US10173833B2 patent drawing
  • US10173833B2 patent drawing
  • US10173833B2 patent drawing

AI summary

Provided is a glass substrate package (1), including a plurality of disc-shaped glass substrates (2) packaged in a box (3), in which the plurality of disc-shaped glass substrates (2) are stacked and packaged in a horizontal posture under a state in which slip sheets (4) are interposed between the plurality of disc-shaped glass substrates (2).