Glass Substrate Inductor Integration for Compact RF Passive Devices
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Solution Overview
Problem
Existing radio frequency chips in mobile phones face challenges with large volume, high power consumption, and inconsistent parasitic parameters due to discrete devices on traditional PCBs, while Si-based chips have high microwave loss and GaAs-based chips are expensive.
Innovation Solution
A substrate integrated with a passive device, featuring a dielectric layer with short-circuited inductor sub-structures on opposite sides, and including a glass substrate with a first connection via to form an induction coil, along with resistors and capacitors, to achieve a compact, high-performance design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If discrete devices are used on traditional PCB, then device functionality is achieved, but volume and power consumption increase
Solution Approach 1:
The patent merges multiple discrete passive devices (resistors, capacitors, inductors) onto a single substrate to form an integrated passive device. This consolidation reduces the overall volume occupied by multiple separate components while maintaining their individual functionalities, directly resolving the contradiction between miniaturization and manufacturing complexity.
Solution Approach 2:
The patent employs three-dimensional vertical stacking architecture where passive devices are arranged in multiple layers along the vertical dimension. Connection vias penetrate through dielectric layers to establish electrical connections between different levels, enabling compact integration without increasing planar footprint, thus reducing volume while preserving manufacturing feasibility.
2Ease of manufacture
If Si-based substrates are used for integrated passive devices, then cost is reduced, but microwave loss increases
Solution Approach 1:
The patent modifies the material composition of the substrate by incorporating glass materials with optimized dielectric properties. This parameter change in material selection reduces microwave loss while maintaining cost-effectiveness, resolving the contradiction between low cost and low microwave loss performance.
Solution Approach 2:
The patent uses composite dielectric layers comprising multiple materials with different properties (e.g., glass substrates combined with organic or inorganic dielectric coatings). This composite structure optimizes both electrical performance (reducing microwave loss) and manufacturing cost, balancing the contradictory requirements.
3Reliability
If GaAs-based substrates are used for integrated passive devices, then microwave performance is improved, but cost increases
Solution Approach 1:
The patent adopts cost-effective glass substrate materials that can achieve sufficient microwave performance for practical applications, replacing expensive GaAs substrates. This substitution maintains acceptable reliability while significantly reducing manufacturing cost, resolving the contradiction between performance and cost.
Solution Approach 2:
The patent optimizes the dielectric constant and loss tangent parameters of the glass substrate through material selection and composition adjustment. By carefully controlling these parameters, the substrate achieves microwave performance comparable to GaAs at a fraction of the cost, balancing performance requirements with cost constraints.
4Area of stationary object
If passive devices are integrated on substrate, then area is reduced, but parasitic parameter variation increases
Solution Approach 1:
The patent implements localized compensation structures and optimized ground plane designs around each passive device to minimize mutual coupling and parasitic effects. By tailoring the local electromagnetic environment for each component, the patent reduces parasitic parameter variation while maintaining compact integration, resolving the contradiction between area reduction and parameter consistency.
Data Source
AI summary
The present disclosure provides a substrate integrated with a passive device and a method for manufacturing the same, and belongs to the technical field of communications. The substrate integrated with a passive device according to the present disclosure includes a dielectric layer provided with a first connection via; and the passive device at least including an inductor. The inductor includes a plurality of first sub-structures and a plurality of second sub-structures respectively disposed on two opposite sides of the dielectric layer, and two adjacent first sub-structures of the plurality of first sub-structures are short-circuited by a corresponding one of the plurality of second sub-structures through the first connection via penetrating through the dielectric layer, so as to form an induction coil of the inductor.