Glass Substrate Inductors for Low-Loss Signal Routing
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Solution Overview
Problem
High-speed serial interfaces experience increased insertion loss when routed on traditional electronic packages with standard buildup thicknesses, leading to higher costs, reduced yield, and manufacturing complexities due to the need for additional metal layers and copper density variations.
Innovation Solution
Implementing a multi-layer core with glass or buildup film and glass layers, which eliminates the need for skip layers by providing lower capacitance, allowing for larger trace widths and spacings while maintaining impedance targets, and incorporating inductors and magnetic materials for improved power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If skip-layer routing configuration is used to reduce signaling losses, then signal loss is reduced, but package layer count increases
Solution Approach 1:
The patent extracts the problematic skip layers from the routing configuration and replaces them with glass or buildup film layers. This removes the source of the contradiction by eliminating the need for additional metal layers while preserving the low-loss signaling benefit through the dielectric properties of the glass/film material.
Solution Approach 2:
The patent changes the material parameter from metal (in skip layers) to glass or buildup film. This material substitution fundamentally alters the electrical characteristics, providing the necessary dielectric strength and lower capacitance without requiring additional layers, thus resolving the contradiction between signal loss reduction and layer count increase.
2Loss of energy
If skip-layer routing configuration is used to reduce signaling losses, then signal loss is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent removes the complex copper density control requirements associated with skip layers by extracting the metal layer function and replacing it with glass or buildup film layers. This simplifies manufacturing by eliminating the need for precise copper density variations while maintaining the low-loss signaling capability.
Solution Approach 2:
The patent replaces expensive and complex metal layer configurations with simpler, more manufacturable glass or buildup film layers. This substitution uses materials and processes that are more readily available and easier to manufacture, reducing both cost and manufacturing complexity while achieving the same functional goal of low-loss signaling.
3Ease of manufacture
If standard buildup thicknesses are used in traditional packages, then manufacturing is simpler, but insertion loss increases
Solution Approach 1:
The patent changes the material parameter from standard dielectric materials to glass or buildup film with superior electrical properties. This material parameter change enables lower capacitance and reduced insertion loss while maintaining manufacturing simplicity, as glass and buildup film are standard materials in semiconductor packaging processes.
Solution Approach 2:
The patent employs composite material structures combining glass layers with metal interconnects, or buildup film with standard packaging materials. This composite approach leverages the low-capacitance properties of glass/film while maintaining compatibility with existing manufacturing processes, achieving reduced insertion loss without sacrificing manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces layer count, lowers manufacturing risks, and achieves ultra-low loss signaling and power delivery with reduced costs and complexity, while maintaining signal integrity and efficiency.
Implementation Method 1
providing lower capacitance, allowing for larger trace widths and spacings while maintaining impedance targets
Implementation Method 2
incorporating inductors and magnetic materials for improved power delivery
Data Source
AI summary
Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a first layer that comprises glass. In an embodiment, a second layer comprising glass is over the first layer. In an embodiment, the electronic package further comprises an inductor between the first layer and the second layer.