Glass Encapsulation Substrate Reinforcement for Fine Vias and Low RF Loss
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Solution Overview
Problem
Current encapsulation substrates, such as organic, metal, ceramic, and composite substrates, face challenges like inability to form fine vias, high radio frequency loss, insufficient fine wiring, high processing costs, and technical difficulties, particularly with glass substrates being brittle and prone to damage during processing like reflow soldering.
Innovation Solution
A method for manufacturing an encapsulation substrate involving a glass substrate with a through hole and connection electrodes, where the substrate is thinned to expose these electrodes, and signal traces are formed on both surfaces for electrical connection to chips and printed circuit boards, using techniques like electroplating and CMP for structural reinforcement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If glass substrate is thinned to less than hundred micrometers for encapsulation, then the substrate achieves good insulation and low dielectric loss, but the glass becomes prone to smashing during warm pressing processes
Solution Approach 1:
The patent uses a composite structure consisting of a glass substrate combined with a reinforcing layer. The glass substrate provides low dielectric loss and good insulation, while the reinforcing layer (made of metal or ceramic material) compensates for the brittleness and prevents smashing during warm pressing processes. This composite approach allows the thin glass substrate to maintain both its electrical performance and mechanical strength.
Solution Approach 2:
The patent changes the physical parameters of the glass substrate by controlling its thickness to be less than hundred micrometers while simultaneously introducing a reinforcing layer. This parameter change allows the substrate to achieve the desired electrical properties (low dielectric loss) while the reinforcing layer ensures mechanical integrity during processing.
2Ease of manufacture
If conventional organic substrate is used for encapsulation, then the substrate is easy to process, but fine vias cannot be formed
Solution Approach 1:
The patent changes the material parameter from organic substrate to glass substrate, which enables the formation of fine vias with precise dimensions. The glass material allows for better via formation precision while maintaining reasonable processability through appropriate processing techniques.
3Strength
If metal substrate is used for encapsulation, then the substrate provides good structural support, but radio frequency loss is high
Solution Approach 1:
The patent employs a composite structure where the glass substrate serves as the main body providing low dielectric loss and good insulation for RF signal transmission. The metal reinforcing layer provides structural support and mechanical strength. This composite approach separates the functions: glass for electrical performance and metal for mechanical support, thereby resolving the contradiction between structural strength and RF loss.
4Stability of the object's composition
If ceramic substrate is used for encapsulation, then the substrate has good chemical stability, but fine wiring is insufficient and processing cost is high
Solution Approach 1:
The patent uses a glass substrate combined with a reinforcing layer to achieve fine wiring capability. The glass material allows for precise via and wiring formation, while the composite structure maintains chemical stability. This approach improves upon conventional ceramic substrates by enabling better fine wiring while potentially reducing processing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach creates a robust and efficient encapsulation substrate with low dielectric loss, suitable for high-frequency signal transmission, while minimizing the risk of substrate damage during processing by using structural reinforcement and appropriate adhesive layers.
Implementation Method 1
thinning the initial substrate from a side of the second surface to form a dielectric substrate including a through hole and to expose the first connection electrode
Implementation Method 2
forming a first connection electrode in the blind hole
Implementation Method 3
forming a first connection electrode in the blind hole
Implementation Method 4
forming a first signal trace on the first surface such that one end of the first signal trace is electrically connected to the first connection electrode
Implementation Method 5
forming a first signal trace on the first surface
Implementation Method 6
fixing a carrier substrate on a side of the first signal trace away from the first surface
Data Source
AI summary
An encapsulation substrate and a manufacturing method therefor, and a functional substrate and a manufacturing method therefor are provided. The method for manufacturing an encapsulation substrate includes providing an initial substrate having first and second surfaces oppositely arranged along a thickness direction thereof; processing the initial substrate to form a blind hole extending through a part of the initial substrate in the thickness direction; forming a first connection electrode in the blind hole, and forming a first signal trace on the first surface; thinning the initial substrate from a side of the second surface to form a dielectric substrate and expose the first connection electrode; forming a second signal trace on a side of the dielectric substrate away from the first signal trace such that one of the first and second signal traces is electrically connected to the chip; the other one is electrically connected to the printed circuit board.