Metallized Paste Filling for Glass Substrate Adhesion

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current methods for creating through-holes in glass substrates for semiconductor applications lack effective adhesion and hermeticity, which are crucial for efficient signal transfer and durability, especially when integrating multiple devices in a single package.

Innovation Solution

A method involving strengthening the glass substrate, applying a protective layer, creating through-holes using etching or laser techniques, and filling these holes with a metallized paste material comprising metals, glass frit, solvents, and inert additives, followed by thermal processing for adhesion and hermeticity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If through-holes are created in glass substrates using conventional methods, then signal transfer capability is achieved, but adhesion and hermeticity are insufficient

Engineering Contradiction:

Improveadhesion and hermeticityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The glass substrate is strengthened through ion exchange or chemical treatment before through-hole creation. This preliminary strengthening prevents crack propagation during drilling and ensures the substrate can withstand subsequent processing steps, thereby achieving both good adhesion/hermeticity and manufacturing feasibility

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

A multi-layer composite structure is formed by depositing alternating layers of dielectric material and conductive material within the through-holes. This composite filling approach provides both mechanical support for adhesion and electrical connectivity, while the layered structure enhances hermetic sealing through multiple interfaces

Inventive Principle:

Principle #40Composite materials

2Strength

If glass substrate is strengthened to increase durability, then adhesion and hermeticity improve, but processing complexity increases

Engineering Contradiction:

Improvesubstrate durabilityVSAvoidprocess steps

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

Ion exchange strengthening is performed as a preliminary step before through-hole drilling. The ion exchange process replaces smaller ions with larger ions in the glass surface, creating compressive stress that strengthens the substrate. This single preliminary action significantly improves durability without requiring multiple complex process steps

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The chemical composition of the glass substrate is modified through ion exchange, changing the physical parameters of the glass surface. This parameter change increases the strength and durability of the substrate, enabling it to withstand subsequent processing while maintaining simplicity in the overall process flow

Inventive Principle:

Principle #35Parameter changes

3Reliability

If through-holes are filled with metallized paste material, then electrical connectivity is achieved, but adhesion to glass surface is insufficient

Engineering Contradiction:

Improveelectrical connectivityVSAvoidadhesion strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The through-holes are filled with a composite metallized paste material containing metal particles, glass frit, and organic vehicle. The glass frit component chemically bonds to the glass substrate, while the metal particles provide electrical connectivity. This composite approach simultaneously achieves both adhesion and electrical connectivity

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The metallized paste material undergoes thermal processing in an oxidizing atmosphere, which accelerates the chemical reactions between the glass frit and the glass substrate surface. This accelerated oxidation enhances the bonding strength between the filling material and the glass, ensuring strong adhesion while maintaining electrical connectivity

Inventive Principle:

Principle #38Strong oxidants (Accelerated oxidation)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the durability and electrical performance of glass substrates by achieving strong adhesion and hermetic sealing, enabling efficient signal transfer and improved integration of heterogeneous devices.

Implementation Method 1

achieves excellent adhesion and hermeticity between the filling material and glass substrate

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

achieves excellent adhesion and hermeticity between the filling material and glass substrate

Methodology Applied

Scientific EffectHermetic sealing:

Implementation Method 3

heat treating the glass substrate to repair damage from the hole creation process

Methodology Applied

Scientific EffectHeat treatment: Heat Treatment

Data Source

PatentUS9236274B1Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components

Publication Date: 2016.01.12 AGC INC

AI summary

A method of processing a glass substrate for use in semi-conductor packaging applications. Through holes are created in a glass substrate and subsequently filled with a metallized paste material. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substrate. The surface of the glass substrate is coated with at least one redistribution layer of a metal, a metal oxide, an alloy, a polymer, or a combination thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.