Glass Substrate Separation Using Wire and Vacuum Adsorption
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Solution Overview
Problem
The direct lifting off method for removing glass substrates from OLED modules during production often damages the PI layer, leading to a decrease in yield due to excessive pulling force.
Innovation Solution
A glass substrate separation device and method using a lifting off platform with vacuum adsorption devices and a separation wire to carefully separate the glass substrate from the OLED, avoiding contact with the PI layer and minimizing damage, while a second vacuum adsorption device removes the glass substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If direct lifting off method is used to remove glass substrate, then removal efficiency is improved, but the PI layer and OLED are easily damaged due to large pulling force
Solution Approach 1:
The glass substrate removal process is divided into multiple stages: first creating a separation opening, then inserting a separation wire to split the substrate, and finally removing the separated pieces. This segmentation allows the large pulling force to be distributed and controlled, preventing damage to the PI layer and OLED while maintaining removal efficiency.
2Speed
If large pulling force is applied to separate glass substrate, then separation speed is improved, but the PI layer is easily damaged
Solution Approach 1:
A separation wire is introduced as an intermediary tool between the glass substrate and the pulling force. The wire is inserted into a pre-created opening and used to split the substrate from underneath, allowing separation to occur without applying direct large pulling force on the PI layer, thus preventing damage while maintaining separation speed.
3Manufacturing precision
If vacuum adsorption devices are used to hold glass substrate, then positioning precision is improved, but device complexity increases
Solution Approach 1:
Vacuum adsorption devices are used to hold and position the glass substrate during the separation process. The vacuum suction nozzles provide precise positioning by adsorbing the substrate at specific locations, enabling accurate control of the separation process. The complexity is managed by integrating these pneumatic devices into the existing separation mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents damage to the OLED and PI layer, enhancing the yield of OLED modules by using a controlled separation process that reduces mechanical stress during glass substrate removal.
Implementation Method 1
The lifting off platform is provided with a plurality of vacuum holes, and the OLED is placed on the lifting off platform and corresponds to positions of the plurality of vacuum holes, and the vacuum holes are connected to a vacuum device to adsorb the OLED on the lifting off platform.
Implementation Method 2
the plurality of first vacuum adsorption devices is adsorbed on a first position of the glass substrate
Implementation Method 3
the second vacuum adsorption device is adsorbed on a second position of the glass substrate to remove the glass substrate from the OLED
Data Source
AI summary
Disclosed are a glass substrate separation device and a glass substrate separation method. A plurality of first vacuum adsorption devices is adsorbed on one end of the glass substrate to separate the one end of the glass substrate and an OLED with an opening with a certain distance, and a metal wire is driven to enter the opening, and abuts a lower surface of the glass substrate to move to the other end of the glass substrate to accomplish the separation between the glass substrate and the OLED; and then, a second vacuum adsorption device is adsorbed at an intermediate position of the glass substrate to remove the glass substrate from the OLED to realize a glass substrate removal process after a LLO in an OLED module production, thereby avoiding a damage to the OLED and a PI layer disposed on a surface layer of the OLED.