Glass Substrate Shielding Walls for High-Frequency Signal Lines
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Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently transmitting high-frequency signals due to signal attenuation and frequency dispersion in traditional transmission lines, and metal shielding methods are limited in fully encapsulating signal lines to prevent interference.
Innovation Solution
The use of glass substrates with partial trenches or walls that enclose signal lines and are electrically coupled to ground, providing enhanced signal shielding and reducing mechanical warping through improved material properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional transmission lines are used in semiconductor packages, then manufacturing is simpler, but signal loss and frequency dispersion increase at high frequencies
Solution Approach 1:
The shielding structure is segmented into multiple discrete stitching vias distributed along the transmission line, rather than using a continuous shield. This segmentation reduces the complexity of the shielding structure while effectively reducing signal loss through multiple ground reference points that minimize electromagnetic interference and frequency dispersion
Solution Approach 2:
The stitching vias are strategically positioned at specific locations along the transmission line where electromagnetic interference is most problematic. This local quality approach concentrates shielding resources at critical points rather than uniformly distributing them, reducing overall signal loss while minimizing the complexity of the shielding structure
2Object-affected harmful factors
If metal shielding is used to enclose signal lines, then signal interference is reduced, but complete encapsulation is difficult to achieve
Solution Approach 1:
The shielding approach transitions from attempting complete three-dimensional encapsulation to using a planar arrangement of stitching vias that provide effective shielding in the critical electromagnetic interference dimensions. This dimensional change allows for more complete practical encapsulation by distributing shield points across the signal line path rather than requiring full surrounding enclosure
Solution Approach 2:
Instead of attempting complete encapsulation with continuous shielding, the invention uses multiple discrete stitching vias that provide partial shielding at strategic locations. This partial action approach achieves effective interference reduction by addressing the most critical interference points without the complexity of complete encapsulation
3Reliability
If glass substrate with trenches and stitching vias is used, then signal shielding is enhanced, but manufacturing complexity increases
Solution Approach 1:
The trenches are formed in the glass substrate before the stitching vias are created and filled. This preliminary action allows the trench structure to be established as a template, guiding subsequent via placement and ensuring proper alignment. This sequence reduces manufacturing complexity by breaking down the complex multi-step process into manageable stages with built-in alignment references
Solution Approach 2:
The stitching vias are nested within the trench structures, with conductive material filling the trenches and forming integrated shield elements. This nesting approach combines multiple functional elements (trenches for mechanical support and electrical isolation, vias for electrical connection to ground) into a unified structure, reducing the number of separate manufacturing steps and improving ease of manufacture while maintaining shielding effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces signal loss and interference by fully encapsulating signal lines with shielding walls, while also preventing mechanical warping of the substrate, thus enhancing the stability and performance of semiconductor packages.
Implementation Method 1
An electrically conductive material positioned in the channel, the conductive material to provide electromagnetic shielding to the transmission line
Data Source
AI summary
Glass substrates having signal shielding for use with semiconductor packages and related methods are disclosed. An example semiconductor package includes a core layer defining a channel and a through glass via (TGV). The channel at least partially surrounding the TGV. A signal transmission line is provided in the opening and extending through the core layer. An electrically conductive material positioned in the channel. The conductive material to provide electromagnetic shielding to the transmission line.