Glass Substrate Composition for Dielectric Loss and Thermal Shock
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Solution Overview
Problem
Conventional glass substrates exhibit high dielectric loss tangent values in the GHz band, making it difficult to maintain signal quality and strength, and are prone to cracking due to thermal shocks, especially in outdoor applications with temperature fluctuations.
Innovation Solution
A glass substrate with a Young's modulus and average coefficient of thermal expansion product of 300 GPa·ppm/°C or less, relative permittivity of 10 or less at 20°C and 35 GHz, and dielectric loss tangent of 0.006 or less, providing improved thermal-shock resistance and reduced dielectric loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional glass substrates are used for high-frequency applications, then rigidity and surface smoothness are improved, but dielectric loss tangent increases causing signal quality degradation
Solution Approach 1:
The patent applies parameter changes by precisely controlling the chemical composition of the glass substrate (specific ratios of SiO2, B2O3, Al2O3, and other oxides) and processing parameters (heating temperature, cooling rate) to achieve optimal dielectric properties while maintaining mechanical strength. This resolves the contradiction by finding the right parameter range where both rigidity and low dielectric loss are achieved simultaneously.
Solution Approach 2:
The patent uses composite material approach by creating a multi-component glass system combining silica, boron oxide, aluminum oxide, and various metal oxides in specific proportions. This composite glass composition achieves a balance between mechanical properties (rigidity) and electrical properties (low dielectric loss) that cannot be obtained with single-component materials.
2Adaptability or versatility
If conventional glass substrates are perforated using laser processing, then antenna functionality is improved, but thermal shock causes cracking
Solution Approach 1:
The patent changes the thermal parameters of the glass substrate by controlling its composition (particularly B2O3 content at 20-40 mol% and specific heating/cooling rates during processing) to achieve a material that can withstand the thermal shocks of laser perforation without cracking, while still enabling antenna functionality.
Solution Approach 2:
The patent applies preliminary action by pre-treating the glass substrate through controlled heating and cooling processes before laser perforation, and by designing the composition to have inherent thermal shock resistance, thereby preventing cracking before the laser processing step occurs.
3Loss of energy
If resin substrates are used for high-frequency applications, then dielectric loss is reduced, but rigidity and strength decrease
Solution Approach 1:
The patent uses composite materials by formulating a glass composition that combines the low dielectric loss characteristics typically associated with resin materials with the high rigidity and strength of glass. The specific multi-component glass system achieves properties that bridge the gap between resin and traditional glass substrates.
Solution Approach 2:
The patent applies parameter changes by optimizing the glass composition parameters (oxide ratios, impurity levels) and processing parameters to achieve a material with dielectric loss characteristics comparable to resin substrates while maintaining the inherent rigidity and strength advantages of glass.
4Strength
If ceramic substrates are used for high-frequency applications, then strength and rigidity are improved, but surface smoothness and manufacturing precision deteriorate
Solution Approach 1:
The patent changes the surface properties parameters by controlling the glass composition (particularly SiO2 content at 60-80 mol%) and applying specific surface treatment processes during manufacturing, achieving surface smoothness suitable for high-precision conductor formation while maintaining the inherent strength of ceramic-like materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The glass substrate effectively reduces dielectric loss and enhances thermal-shock resistance, enabling high-performance liquid-crystal antennas and high-frequency devices that can withstand temperature fluctuations and laser perforation.
Implementation Method 1
the product of the Young's modulus and the average coefficient of thermal expansion at 50-350° C.
Implementation Method 2
Young's modulus (GPa)
Data Source
AI summary
Provided is a glass substrate with which it is possible to reduce dielectric loss in high-frequency signals, and which also has excellent thermal shock resistance. This invention satisfies the relation {Young's modulus (GPa)×average thermal expansion coefficient (ppm/° C.) at 50-350° C.}≤300 (GPa·ppm/° C.), wherein the relative permittivity at 20° C. and 35 GHz does not exceed 10, and the dielectric loss tangent at 20° C. and 35 GHz does not exceed 0.006.