Glass Substrate Thickness Control for High-Density Wiring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor package manufacturing methods face challenges in achieving high-density wiring and accurate recognition of production information on glass substrates, leading to potential deformation and reduced accuracy in semiconductor chip mounting.
Innovation Solution
A glass substrate with a total thickness variation of less than 2.0 μm and an information identification part formed by thermal shock through laser irradiation, comprising a plurality of dots for enhanced processing accuracy and automated recognition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a glass substrate is used as a supporting substrate, then the stiffness of the laminate is increased and warping deformation is suppressed, but the total thickness variation of the glass substrate causes difficulty in high-density wiring and accurate solder bump formation
Solution Approach 1:
The patent applies parameter changes by strictly controlling the total thickness variation of the glass substrate to be 3 μm or less. This quantitative parameter control transforms the glass substrate from a component with variable thickness that causes wiring errors to one with precise dimensional stability, enabling high-density wiring while maintaining the stiffness benefits of glass material
2Loss of information
If irregularities are formed on the surface of the glass substrate for information identification, then production information can be recognized, but the substrate cannot be supported with high accuracy and wiring arrangement becomes difficult
Solution Approach 1:
The patent applies local quality by creating a dual-layer surface structure: the front surface maintains high flatness (total thickness variation ≤3 μm) for precise wiring and substrate support, while the back surface contains localized irregularities formed by laser irradiation for information identification. This spatial separation of functions allows both information recognition and high-precision manufacturing to coexist without interference
3Reliability
If the ratio of sealing material in the substrate to be processed is large, then semiconductor chips can be protected, but the substrate changes dimension more remarkably during heat treatment
Solution Approach 1:
The patent applies the intermediary principle by introducing a glass substrate as a mediating supporting substrate between the sealing material and the final product. The glass substrate acts as a dimensionally stable reference frame that compensates for the thermal expansion of the sealing material, maintaining overall dimensional stability while allowing the sealing material to perform its protective function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-density wiring, improved in-plane strength, and increased reuse of the glass substrate, while allowing for accurate automated recognition of production information, reducing warpage and deformation during semiconductor package manufacturing.
Implementation Method 1
the glass substrate has substantially the same thermal expansion coefficient as that of the substrate to be processed within a temperature range from room temperature to 200° C. or 300° C.
Implementation Method 2
an information identification part formed of a plurality of dots on the glass substrate
Data Source
AI summary
A technical object of the present invention is to devise a glass substrate that is suitable for supporting a substrate to be processed to be subjected to high-density wiring and enables correct recognition of production information and the like, and a laminate using the glass substrate. In order to achieve the technical object, the glass substrate of the present invention has a total thickness variation of less than 2.0 μm and includes an information identification part formed of a plurality of dots.