Glass Substrate Through Holes High Precision Laser Drilling
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Solution Overview
Problem
Conventional glass substrates with through holes face challenges in achieving high dimensional accuracy, leading to variations in shape that affect the filling of electrically conductive materials and device characteristics, making them unsuitable for sophisticated devices.
Innovation Solution
A glass substrate design featuring through holes with specific shape features, including a first opening with a diameter greater than the second opening, roundness of 5 μm or less, and perpendicularity ranging from 1.00000 to 1.00015, achieved using a method involving a circularly polarized laser beam and a blower to ensure uniform energy distribution and minimize filling matter, resulting in high accuracy and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional glass substrates with through holes are used, then manufacturing is simpler, but dimensional accuracy and shape uniformity deteriorate
Solution Approach 1:
The patent applies preliminary action by pre-heating the glass substrate to a specific temperature range (400-1000°C) before laser processing. This pre-heating step prepares the glass in advance to reduce thermal shock during laser drilling, enabling formation of through holes with high dimensional accuracy (roundness of 5 μm or less and perpendicularity of 1.00000 to 1.00015) while managing the overall process complexity.
Solution Approach 2:
The patent employs parameter changes by controlling multiple process parameters including laser beam power density distribution, substrate temperature, and processing atmosphere. By optimizing these parameters, the invention achieves high manufacturing precision for through hole dimensions while maintaining a feasible manufacturing process using standard laser equipment with additional heating and atmosphere control.
2Reliability
If through holes are formed with high dimensional accuracy, then device characteristics improve, but manufacturing difficulty increases
Solution Approach 1:
The patent achieves high reliability of device characteristics by controlling key parameters including laser beam power density distribution, substrate temperature (400-1000°C), and processing atmosphere. These parameter controls ensure uniform through hole formation with roundness of 5 μm or less and perpendicularity of 1.00000 to 1.00015, while keeping manufacturing relatively easy through a systematic process approach.
Solution Approach 2:
The patent introduces an intermediary controlled atmosphere environment during laser processing. This atmosphere control acts as a mediator between the laser beam and glass substrate, preventing unwanted reactions and ensuring consistent through hole formation. This intermediary approach improves manufacturing ease while maintaining high dimensional accuracy and device reliability.
3Manufacturing precision
If laser processing is used to form through holes, then precision improves, but thermal distortion and filling matter increase
Solution Approach 1:
The patent applies preliminary action by pre-heating the glass substrate to 400-1000°C before laser processing. This pre-heating reduces thermal shock during laser drilling by minimizing the temperature differential between the laser-heated zone and surrounding glass. Additionally, the processing atmosphere is prepared in advance to prevent filling matter formation, thereby maintaining high shape accuracy while eliminating harmful thermal effects.
Solution Approach 2:
The patent converts the potentially harmful thermal shock into a beneficial controlled thermal process. By deliberately heating the substrate to specific temperatures before laser processing and controlling the atmosphere, the method transforms what would be harmful thermal gradients into a controlled environment that prevents filling matter formation and maintains high through hole accuracy, turning thermal challenges into process advantages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed glass substrate design significantly reduces shape-related degradation of device characteristics, enabling it to be fully applicable to highly sophisticated devices with improved filling and performance.
Implementation Method 1
processing by irradiating a glass substrate with a laser beam
Implementation Method 2
a blower to ensure uniform energy distribution and minimize filling matter
Data Source
AI summary
A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 μm or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.