Glass Substrate Through Vias via Laser Modified Etching

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Solution Overview

Problem

The formation of through holes in glass substrates for glass substrates with through glass vias reduces mechanical strength, making handling difficult and complicating the formation of conductive circuits, as laser irradiation can damage pre-formed circuits, and existing dry etching methods are slow and impractical.

Innovation Solution

A method involving laser irradiation to create modified portions in the glass substrate, followed by etching with a specific etchant to form through holes quickly and prevent damage to conductive portions, including steps for forming conductive portions and through glass vias.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If through holes are formed in a glass substrate before forming conductive portions, then handling is difficult due to reduced mechanical strength, but forming through holes after conductive portions is damaged by laser heat

Engineering Contradiction:

Improvehandling easeVSAvoidlaser heat damage to conductive portions

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The through hole formation process is divided into two distinct stages: first, laser irradiation creates a modified portion in the glass substrate without forming a complete through hole, preserving mechanical strength; second, chemical etching completes the through hole formation after conductive portions are formed. This segmentation allows each stage to be optimized independently, avoiding the harmful effects of complete through hole formation before conductive portion deposition.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The laser irradiation step performs a preliminary action by creating a modified portion in the glass substrate that facilitates subsequent etching. This preliminary modification prepares the glass for rapid etching while maintaining the substrate's mechanical integrity during the conductive portion formation process, enabling through hole completion after conductive portions are in place.

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If dry etching is used to form through holes in glass substrate, then through holes can be formed, but the process takes too long and is impractical

Engineering Contradiction:

Improvethrough hole formation capabilityVSAvoidthrough hole formation speed

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces the mechanical/physical dry etching process with a chemical wet etching process. The laser-modified glass substrate is treated with a chemical etchant that rapidly removes material through chemical reactions, achieving much higher etching rates and productivity compared to conventional dry etching methods while maintaining precise through hole formation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the etching mechanism from physical (dry etching) to chemical (wet etching), and further optimizes by using laser irradiation to modify the glass substrate's properties. This parameter change enables the etchant to selectively and rapidly remove laser-modified glass, achieving high-speed through hole formation with precise control over hole dimensions and position.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for easy handling of glass substrates during conductive portion formation and rapid through hole creation without damaging pre-formed circuits, enhancing mechanical strength and efficiency.

Implementation Method 1

irradiating an area of a glass substrate with a laser beam to form a modified portion in the area irradiated with the laser beam

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

forming a through hole in the glass substrate after the first conductive portion forming step by etching at least the modified portion using an etchant that etches the modified portion at an etching rate higher than an etching rate at which the etchant etches an area of the glass substrate where the modified portion is not formed

Methodology Applied

Scientific EffectChemical etching:

Data Source

PatentUS10727048B2Method for producing glass substrate with through glass vias and glass substrate

Publication Date: 2020.07.28 NIPPON SHEET GLASS CO LTD

AI summary

A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.