Glass Substrate Viscosity Control for Heat Resistance and Meltability
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Solution Overview
Problem
Glass substrates for high-definition displays face a challenge in balancing high heat resistance and productivity, as increasing heat resistance tends to reduce meltability and fining properties, while improving productivity decreases heat resistance.
Innovation Solution
Restricting the viscosity characteristics of the glass substrate within specific ranges, such as a temperature at 102.5 dpa·s of 1,670° C. or less and an estimated viscosity Log η500 at 500° C. of 26.0 or more, to enhance heat resistance while maintaining productivity, using equations and methods like platinum sphere pull-up and FT-IR for accurate evaluation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the heat resistance of the glass substrate is increased, then the thermal shrinkage is reduced, but the productivity (meltability or fining property) is reduced
Solution Approach 1:
The patent applies parameter changes by precisely controlling the viscosity characteristics of the glass substrate. Specifically, it sets the temperature at viscosity 102.5 dpa·s to 1,670°C or less and the estimated viscosity Log η500 at 500°C to 26.0 or more. These parameter specifications enable the glass to achieve both high heat resistance and good meltability, resolving the contradiction between reliability and productivity.
2Reliability
If the heat resistance of the glass substrate is increased, then the thermal shrinkage is reduced, but the fining property is reduced
Solution Approach 1:
The patent resolves this contradiction through parameter changes by establishing specific viscosity ranges. The estimated viscosity Log η500 at 500°C is set to 26.0 or more, which ensures adequate fining property while maintaining high heat resistance. This parameter control allows bubbles to be effectively removed during the fining process without compromising the glass's thermal stability.
3Productivity
If the productivity of the glass substrate is increased, then the meltability is improved, but the heat resistance is reduced
Solution Approach 1:
The patent applies parameter changes by setting the temperature at viscosity 102.5 dpa·s to 1,670°C or less. This parameter enables good meltability for high productivity while simultaneously ensuring heat resistance. The dual parameter control (temperature at 102.5 dpa·s and estimated viscosity Log η500) creates an optimal balance between productivity and reliability.
4Productivity
If the productivity of the glass substrate is increased, then the fining property is improved, but the heat resistance is reduced
Solution Approach 1:
The patent resolves this contradiction through parameter changes by specifying the estimated viscosity Log η500 at 500°C to be 26.0 or more. This parameter ensures excellent fining property for high productivity while maintaining the heat resistance required for LTPS TFT and oxide TFT manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for accurate evaluation and enhancement of heat resistance, reducing thermal shrinkage rates, and maintaining high productivity, ensuring suitable glass substrates for high-definition displays like OLED devices.
Implementation Method 1
the viscosity characteristic of the glass substrate, that is, a temperature at a viscosity at high temperature of 102.5 dpa·s and an estimated viscosity Log η500 at 500° C.
Implementation Method 2
the glass substrate is required to have higher heat resistance than related-art substrates so as to be reduced in thermal shrinkage
Data Source
AI summary
A glass substrate of the present invention has a temperature at a viscosity at high temperature of 102.5 dPa·s of 1,650° C. or less, and an estimated viscosity Log η500 at 500° C. of 26.0 or more calculated by the equation Log η500=0.167×Ps−0.015×Ta−0.062×Ts−18.5.