Glass Substrate Warpage for Bubble-Free Lamination
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Solution Overview
Problem
In the semiconductor industry, when using a glass substrate with a smooth surface in wafer-level packaging, air bubbles often remain between the glass and silicon-containing substrates during assembly, hindering their proper sticking together.
Innovation Solution
A glass substrate with a warpage of 2 μm to 300 μm and an inclination angle due to warpage of 0.0004° to 0.12° is developed, allowing for effective removal of air bubbles during the lamination process, ensuring better adhesion between the glass and silicon-containing substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a glass substrate with a smooth surface is used, then the surface quality is improved, but air bubbles remain between the glass substrate and silicon-containing substrate during assembly
Solution Approach 1:
The invention applies curvature (warpage) to the glass substrate surface, transforming it from a perfectly flat state to a controlled curved state. This curvature enables air bubbles to be expelled during lamination while maintaining overall surface quality, resolving the contradiction between smooth surface and bubble-free adhesion.
Solution Approach 2:
The invention changes the physical parameter of the glass substrate from zero warpage to a controlled warpage range (2 μm to 300 μm). This parameter change allows the substrate to facilitate air bubble removal during assembly while preserving surface quality standards, thus resolving the adhesion quality issue.
2Stability of the object's composition
If the glass substrate is made perfectly flat, then the surface uniformity is improved, but bubbles are difficult to remove during lamination
Solution Approach 1:
The invention introduces controlled curvature to the otherwise uniform glass substrate. This curvature serves as a mechanism to facilitate air bubble removal during lamination while maintaining surface uniformity within acceptable ranges, making the lamination process easier to execute.
Solution Approach 2:
The invention modifies the warpage parameter from 0 μm to a controlled range (2 μm to 300 μm), creating an optimal balance between surface uniformity and lamination ease. This parameter adjustment enables bubbles to be removed while preserving sufficient surface uniformity for quality requirements.
3Ease of manufacture
If a glass substrate with large warpage is used, then air bubbles are easily removed, but the inclination angle becomes too large affecting alignment
Solution Approach 1:
The invention establishes an optimized parameter range for warpage (2 μm to 300 μm) and corresponding inclination angle (0.0004° to 0.12°). This parameter optimization ensures that air bubbles can be effectively removed while the inclination angle remains small enough to maintain alignment precision during assembly.
Data Source
AI summary
The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.