Customized Glass Substrates for Semiconductor Packaging
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Solution Overview
Problem
The semiconductor packaging industry faces challenges in manufacturing a single carrier substrate that meets the diverse requirements of different manufacturers due to varying processing techniques, necessitating alternative glass substrates with tailored thermal expansion coefficients and modulus properties.
Innovation Solution
A glass article composition comprising specific ranges of SiO2, Al2O3, MgO, Na2O, La2O3, Y2O3, and other oxides, with adjusted cation field strengths to achieve a coefficient of thermal expansion between 45×10−7°C and 70×10−7°C and a Young's modulus of at least 82 GPa, allowing for customization to meet individual manufacturer specifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single carrier substrate design is manufactured to meet diverse manufacturer requirements, then versatility and adaptability improve, but manufacturing precision and property control worsen due to varying processing techniques
Solution Approach 1:
The patent applies parameter changes by systematically adjusting the chemical composition parameters of the glass substrate, specifically controlling the ratios of network formers (SiO2, B2O3), network modifiers (Na2O, K2O, CaO, MgO), and intermediates (Al2O3). By varying these compositional parameters within defined ranges, the patent achieves target coefficients of thermal expansion (45-70×10^-7/°C) and modulus (≥82 GPa) that accommodate different manufacturer processing techniques while maintaining manufacturing precision through controlled composition specifications.
Solution Approach 2:
The patent employs composite material principles by creating a multi-component glass system that combines different oxide components with complementary properties. The glass substrate integrates network formers for structural stability, network modifiers for thermal expansion control, and intermediates for mechanical property enhancement. This composite composition approach enables the single substrate design to simultaneously satisfy diverse thermal and mechanical requirements of various semiconductor packaging processes.
2Strength
If glass composition is optimized for high modulus and target CTE, then mechanical strength and thermal stability improve, but manufacturing complexity increases due to precise composition control requirements
Solution Approach 1:
The patent manages manufacturing complexity through parameter changes by establishing clear compositional ranges for each oxide component rather than requiring exact stoichiometric ratios. The specification defines intervals such as SiO2 (40-70 wt%), B2O3 (5-20 wt%), Na2O (10-20 wt%), which provides manufacturing flexibility while ensuring the final product achieves the desired Young's modulus (≥82 GPa) and coefficient of thermal expansion (45-70×10^-7/°C). This range-based parameter control balances property optimization with manufacturing feasibility.
Solution Approach 2:
The patent applies local quality principles by assigning specific functional roles to different compositional regions within the glass system. Network formers (SiO2, B2O3) are optimized for structural framework and thermal stability, network modifiers (Na2O, K2O, CaO, MgO) are controlled for thermal expansion behavior, and intermediates (Al2O3) are positioned to enhance mechanical strength. This functional segmentation of compositional elements allows each component to be optimized for its specific contribution while simplifying the overall manufacturing control strategy.
Data Source
AI summary
A glass article includes: from 60 mol % to 80 mol % SiO2; from 5 mol % a to 25 mol % Al2O3; from 0.25 mol % to 10 mol % MgO; from 0.25 mol % to 10 mol % Na2O; from 0 mol % to 2 mol % Li2O; from 0 mol % to 9 mol % La2O3; and from 0 mol % to 9 mol % Y2O3. La2O3+Y2O3 is from 2 mol % to 9 mol %. (La2O3+Y2O3)/(R2O+RO) is from 0.1 to 2, R2O being the sum of Na2O, Li2O, and K2O, and RO being the sum of MgO, CaO, SrO, and BaO.