Glass Through-Hole Sidewall Smoothing for High-Frequency Transmission
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Solution Overview
Problem
Existing techniques for forming through electrodes in glass substrates fail to consider the impact of side surface roughness on transmission characteristics, particularly in high frequency bands like the sub-6 GHz band used for 5G, leading to insufficient transmission performance due to roughness exceeding 1,000 nm and PV of 1,500 nm.
Innovation Solution
The glass substrate is designed with through holes having a side surface roughness of 1,000 nm or less and an unevenness width of 1,500 nm or less, achieved through precise laser processing and controlled etching to ensure smooth side surfaces for improved transmission characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional laser processing and etching methods are used to form through holes in glass substrates, then through holes can be formed efficiently, but the side surface roughness becomes 1,000 nm or more and PV becomes 1,500 nm or more, deteriorating transmission characteristics in high frequency bands
Solution Approach 1:
The patent changes the etching parameters by controlling the etching depth and time to achieve a balance between productivity and surface quality. Specifically, the etching is performed to form through holes with side surface roughness of 1,000 nm or less and PV of 1,500 nm or less, which requires precise control of etching conditions while maintaining efficient production
Solution Approach 2:
The patent applies partial action by performing etching to a controlled depth that is sufficient to form functional through holes but not excessive enough to create excessive roughness. This controlled partial etching achieves the required transmission characteristics while maintaining productivity
2Ease of manufacture
If through holes with rough side surfaces are formed, then manufacturing is easier and more productive, but transmission characteristics in high frequency bands such as sub-6 GHz become insufficient
Solution Approach 1:
The patent changes the critical parameter of side surface roughness from conventional values (Ra ≥ 1,000 nm, PV ≥ 1,500 nm) to improved values (Ra ≤ 1,000 nm, PV ≤ 1,500 nm) through controlled etching, thereby improving transmission characteristics while maintaining ease of manufacture through standardized process control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design results in through electrodes with enhanced transmission characteristics in high frequency bands, enabling the production of multilayer wiring substrates with superior performance compared to existing methods.
Implementation Method 1
achieved through precise laser processing and controlled etching to ensure smooth side surfaces
Data Source
AI summary
A glass substrate having a first surface and a second surface, the glass substrate including at least one through hole penetrating from the first surface to the second surface, where a cut surface of the through hole in a thickness direction of the glass substrate has a shape of a side surface, the shape having a dispersion roughness of 1,000 nm or less and an unevenness width of 1,500 nm or less.