Glass Via Measurement Using Interference Patterns
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Solution Overview
Problem
Existing detection technologies for glass vias in chip packaging are time-consuming, destructive, and unable to measure the side wall angles of all vias simultaneously.
Innovation Solution
A non-contact and non-destructive measurement system and method that uses an excitation light source, an image sensor, and a calculator to analyze a 2D interference pattern and generate a 3D geometric-structure image of glass vias, allowing for simultaneous measurement of size, depth, and side wall angle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If laser conjugate focus technology, color conjugate focus technology, or white light scanning technology is used to measure glass vias, then measurement capability is provided, but the measurement process is time-consuming and can only measure single holes
Solution Approach 1:
The patent segments the measurement process by using multiple image sensors to capture different regions of the glass substrate simultaneously. Each image sensor records interference patterns for specific via regions, enabling parallel measurement of multiple vias instead of sequential single-hole measurement, thus improving productivity while maintaining measurement precision.
Solution Approach 2:
The patent transitions from conventional 2D imaging to 3D measurement by capturing interference patterns that encode depth information. The image sensors record not only the position but also the depth of each via by analyzing the interference pattern characteristics, enabling simultaneous measurement of multiple vias in three-dimensional space without increasing measurement time.
2Measurement precision
If conventional measurement methods are used to measure side wall angle of glass vias, then side wall angle measurement is possible, but the sample must be destroyed
Solution Approach 1:
The patent replaces mechanical cutting and physical sample destruction with optical measurement. By using interference patterns formed by light passing through the glass substrate, the system can extract side wall angle information non-destructively. The image sensors capture the interference patterns, and calculation units process these patterns to determine via dimensions and side wall angles without any physical contact or damage to the sample.
Solution Approach 2:
The patent introduces light as an intermediary to measure side wall angles. Instead of directly contacting or cutting the glass via, the system uses light beams that pass through the substrate and create interference patterns. These patterns serve as intermediaries that carry information about the via geometry, allowing indirect but accurate measurement of side wall angles without sample destruction.
3Measurement precision
If destructive measurement methods are used, then via measurements can be obtained, but only vias on the sliced plane of the destroyed sample can be measured
Solution Approach 1:
The patent creates a universal measurement system that can measure all vias on the glass substrate regardless of their position or depth. By using multiple image sensors positioned to capture interference patterns from different regions, the system provides multi-functional measurement capability covering the entire substrate surface and varying depths, unlike destructive methods that are limited to sliced planes.
Solution Approach 2:
The patent extends measurement coverage by utilizing the third dimension (depth) through interference pattern analysis. The image sensors capture interference patterns that encode information about vias at different depths within the glass substrate. By processing these patterns, the system can measure vias throughout the entire substrate thickness, not just on a single plane, thereby achieving comprehensive measurement coverage without sample destruction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables accurate, simultaneous measurement of via dimensions and angles without damaging the glass substrate, overcoming the limitations of existing technologies.
Implementation Method 1
The image sensor is configured to record an image of the excitation light beam passing through a glass substrate having multiples vias. The image is a 2D interference pattern.
Data Source
AI summary
A measurement system including an excitation light source, an image sensor, and a calculator is provided. The excitation light source is configured to emit an excitation light beam. The image sensor is configured to record an image of the excitation light beam passing through a glass substrate having a plurality of vias. The image is a 2D interference pattern. The calculator is electrically connected to the image sensor. The calculator analyzes a 3D geometric-structure image of the vias in the glass substrate according to the image. A measurement method is also provided.